Specifications

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5. Reflow Temperature Profile
Recommended solder reflow profile are shown in below and follow the lead-free profile I
accordance with JEDEC Std 20C.
Table lists the critical reflow temperatures.
Flux residue remaining from board assembly can contribute to electrochemical migration over
time.
This depends on number of factors, including flux type, amount of flux residue remaining after
reflow, and stress conditions during product use, such as temperature, humidity, and potential
difference between pins.
Care should be taken in selecting production board/module assembly processes and materials,
taking into account these factors.
Process Step
Lead-Free Solder
Ramp rate
3°C/sec
Preheat
Max. 150°C to 180°C, 60 to 180 sec
Time above liquidus
+220°C 30 to 90 sec
Peak temperature
+255°C ±5°C
Time within 5°C of peak temperature
10 to 20 sec
Ramp-down rate
6°C/sec max
WARNING : For BCM-DC100-AS.
If you have reflow process multiple times in your product, you must be proceed this
module in the final reflow process. If not the Shield can will drop out.