Datasheet

TE CONNECTIVITY SENSORS /// MS5837-30BA26 REV C2 12/2019
Page 1
The MS5837-30BA is a high-resolution pressure and temperature sensor
from TE Connectivity (TE) with I
2
C bus interface. This sensor is optimized
for water depth measurement systems with a resolution of 0.2 cm. The
sensor module includes a high linearity pressure sensor and an ultra-low
power 24-bit ΔΣ ADC with internal factory calibrated coefficients. It
provides a precise digital 24-bit pressure and temperature value and
different operation modes that allow the user to optimize for conversion
speed and current consumption. A high-resolution temperature output
allows the implementation in depth measurement systems and
thermometer function without any additional sensor. The MS5807-30BA
can be interfaced to virtually any microcontroller. The communication
protocol is simple, without the need of programming internal registers in the
device. The gel protection and antimagnetic stainless-steel cap make the
module water resistant.
Small dimensions of only 3.3 x 3.3 x 2.75 mm allow integration in mobile
devices. Enhanced construction and design materials allow for enhanced
chemical endurance in applications with harsh liquid media environments
with limited exposure. This sensor module generation is based on leading
MEMS technology from TE proven experience and know-how in high
volume manufacturing of sensors modules.
FEATURES
 Ceramic and metal package: 3.3 x 3.3 x 2.75mm
 High resolution module: 0.2 cm (in water)
 Supply voltage: 1.5 to 3.6 V
 Low power: 0.6 µA (standby ≤ 0.1 µA at 25°C)
 Integrated digital pressure sensor (24-bit ΔΣ ADC)
 Operating range: 0 to 30 bar, -20 to +85 °C
 I
2
C interface
 No external components (internal oscillator)
 Water resistant sealing with 1.8 x 0.8mm O-ring
 High chemical endurance
 Shielded metal lid
MS5837-30BA
Ultra-small, gel-filled, pressure sensor with
stainless steel cap
APPLICATIONS
 Dive Computers
 Mobile Water Depth Measurement Systems
 Fitness Trackers
 Wearables