Data Sheet

MS5837-30BA
Ultra Small Gel Filled Pressure Sensor
SENSOR SOLUTIONS /// MS5837-30BA
10/11/2015
15
MOUNTING AND ASSEMBLY CONSIDERATIONS
SOLDERING
Please refer to the application note AN808 available on our website for all soldering recommendations.
MOUNTING
The MS5837-30BA can be placed with automatic Pick & Place equipment using vacuum nozzles. It will not be
damaged by the vacuum. Due to the low stress assembly the sensor does not show pressure hysteresis effects. It
is important to solder all contact pads.
CONNECTION TO PCB
The package outline of the module allows the use of a flexible PCB for interconnection. This can be important for
applications in watches and other special devices.
SEALING WITH O-RINGS
In applications such as outdoor watches the electronics must be protected against direct water or humidity. For
such applications the MS5837-30BA provides the possibility to seal with an O-ring. The O-ring shall be placed at
the groove location, i.e. the small outer diameter of the metal lid. The following O-ring / housing dimensions are
recommended:
O-ring inner diameter
1.8 ± 0.05 mm
O-ring cross-section diameter
0.8 ± 0.03 mm
Housing bore diameter
3.07 ± 0.03 mm
Please refer to the application note AN523 available on our website for O-ring mounting recommendations.
CLEANING
The MS5837-30BA has been manufactured under clean-room conditions. It is therefore recommended to
assemble the sensor under class 10’000 or better conditions. Should this not be possible, it is recommended to
protect the sensor opening during assembly from entering particles and dust. To avoid cleaning of the PCB,
solder paste of type “no-clean” shall be used. Warning: cleaning might damage the sensor.
ESD PRECAUTIONS
The electrical contact pads are protected against ESD up to 2 kV HBM (human body model). It is therefore
essential to ground machines and personnel properly during assembly and handling of the device. The MS5837-
30BA is shipped in antistatic transport boxes. Any test adapters or production transport boxes used during the
assembly of the sensor shall be of an equivalent antistatic material.
DECOUPLING CAPACITOR
Particular care must be taken when connecting the device to the power supply. A minimum of 100nF ceramic
capacitor must be placed as close as possible to the MS5837-30BA VDD pin. This capacitor will stabilize the
power supply during data conversion and thus, provide the highest possible accuracy.