Data Sheet

MS5837-02BA
Ultra Small Gel Filled Pressure & Temperature Sensor, with Stainless Steel Cap
TE CONNECTIVITY SENSORS /// MS5837-02BA 09/2017
Page 14
APPLICATION CIRCUIT
The MS5837 is a circuit that can be used in conjunction with a microcontroller in mobile altimeter applications.
Figure: Typical application circuit
PIN CONFIGURATION AND DEVICE PACKAGE OUTLINE
UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS. GENERAL TOLERANCE ± 0.15mm
1
GND
GROUND
2
VDD
POSITIVE SUPPLY
3
SCL
I
2
C CLOCK
4
SDA
I
2
C DATA
Figure: Package outlines and Pin configuration