Product Data Sheet BM021 BM021 Bluetooth Low Energy Module Datasheet Version 1.3 Issued date: Jan 31, 2019 BLTC Network Corp 9F., No.127-2, Anxing Rd., Xindian Dist., New Taipei City, Taiwan Phone : +886286663611 Mail : sales@bltcnetwork.com.
Product Data Sheet BM021 TABLE OF CONTENTS Revision History ...............................................................................4 1. BNC-TECH BLE Module............................................................5 1.1 Introduction ..................................................................................... 5 1.2 Feature ............................................................................................. 5 2. Ordering Information .............................................
Product Data Sheet BM021 8.1 Federal Communications Commission (FCC) Statement ..... 17 Version : 1.
Product Data Sheet BM021 Revision History Version : 1.3 Revision Date Description V1.0 2017/09/01 Initial release V1.1 2018/03/20 Define 0x01/0x0A type Function V1.2 2018/06/01 Modify 0x01 type pin define V1.
Product Data Sheet BM021 1. BNC-TECH BLE Module BM021 1.1 Introduction BM021 Bluetooth® module is a Telink’s 32Bit MCU SoC Bluetooth low energy products for the Bluetooth Smart market. BM021 increases application code and data space for greater application development flexibility. It is slim and light so the designers can have better flexibilities for the product shapes. The BM021 Bluetooth module compatible with Bluetooth standard and supports BLE specification up to version 4.2.
Product Data Sheet BM021 Processor Embedded 32 Bit MCU with clock Up to 48Mhz Memory Build-in 512KB Program Flash ,16KB SRAM Security Hardware AES-128 Encryption Audio decoder One Analog/Digital MIC ,One Mono Audio Output Firmware Upgrade OTA (Over the Air) or SWS wire Port Power Supply DC 1.9V~3.6V Operating Environment -40 ~ +85°C(VT to +105°C) , 0~95% RH Dimensions 16(L) x 14(W) x 2.25(H) mm(PCB 1.0mm) Environmental standard RoHS-compliant and 100% lead (Pb)-free. Version : 1.
Product Data Sheet BM021 2. Ordering Information BM021XXX-X S S Software Type Hardware Type: P = i-PEX RF out Version E = External RF Pin out Version Y = i-PEX RF out ,PB7 Version Z = External RF Out PB7 Version N7E = TLSR8267 Topr -40~85°C Versions N7V = TLSR8267 Topr -40~105°C Versions N9E = TLSR8269 Topr -40~85°C Versions N9V = TLSR8269 Topr -40~105°C Versions Version : 1.
Product Data Sheet BM021 3. Pin Configurations 3.1 Pin Assignments BM021 Pin -Out Version : 1.
Product Data Sheet BM021 3.2 Pin Description P1 Pin Define Pin No Pin name Type Description 1 3.3V Power Power Source 2 GND GND Ground 3 PWM1/A3 or B7 I/O PWM1,GPIO_PA3(PB7), I2C_SCK(by soft) 4 PWM5/B6 I/O PWM5,GPIO_PB6, I2C_SDA(by soft) 5 PWM4/B4 I/O PWM4,GPIO_PB4 6 PWM3/C3 I/O PWM3,GPIO_PC3,UART_RX 7 PWM2/C2 I/O PWM2,GPIO_PC2,UART_TX Mesh Lighting Application Table LED Lighting Application RGB/ Pin Product type Single CW/WW RGB RGBW WW_CW 01 02 03 04 05 Type Code 3.
Product Data Sheet BM021 2 E0 I/O GPIO_PE0,PWM0 3 E1 I/O GPIO_PE1,PWM1 4 C4 I/O GPIO_PC4,PWM4,UART_RTS 5 C5 I/O GPIO_PC5,PWM5,UART_CTS Version : 1.
Product Data Sheet BM021 P4 Pin Define Pin No Pin name Type Description 1 ANT Analog External RF Pin 2 GND GND Ground Version : 1.
Product Data Sheet BM021 4. Outline Drawing 4.1 Board Dimensions (Unit: mm) Note: ＊The P1 Slot All of Pin have 0.8mm hole design, It can use 1x7 2.0 pith pin header parts to connection host board Version : 1.
Product Data Sheet BM021 5. Electrical Characteristics Absolute Maximum Ratings : Symbol Parameters Maximum rating Unit VDD Power Supply Voltage -0.3 to 3.9 V Tstr Storage Temperature -65 to +150 °C Tsld Soldering Temperature 260 °C VESD ESD protection (HBM) 2000 V Operating Conditions Min. Typ. Max. Unit 1.9 3.3 3.6 V Supply Voltage VDD I/O Supply Voltage 3.3+/-10% V Temperature Range (ET Versions) -40 - 85 ºC Temperature Range (VT Versions) -40 - 105 ºC Min.
Product Data Sheet BM021 6. Soldering 6.1 Recommended Temperature Reflow Profile Maximum number of reflow cycles: 2 Opposite side reflow is prohibited due to the module’s weight. (i.e. you must not place the module on the bottom / underside of your PCB and reflow). 6.2 Hand Soldering Hand soldering is possible. When using a soldering iron, follow IPC recommendations Version : 1.
Product Data Sheet BM021 (reference document IPC-7711). 6.3 Rework The module can be unsoldered from the host board. Use of a hot air rework tool should be programmable and the solder joint and module should not exceed the maximum peak reflow temperature of 250°C. If temperature ramps exceed the reflow temperature profile, module and component damage may occur due to thermal shock. Avoid overheating. Never attempt a rework on the module itself, (e.g. replacing individual components). 6.
Product Data Sheet BM021 7. Application Notes 7.1 Flash Use The BM021 Module has been calibrated by RF before leaving the factory , That has various ID and parameter information of the BM021 module need to be retained, Please don’t use the “EraseF” button to erase the All Flash of the BM021 module 7.2 Mounting BM021 has two sets of soldering pads, which allow it to be mounted both in horizontal and vertical position.
Product Data Sheet BM021 8. Compliance information Compliance Information Radio USA FCC Part 15 Subpart C FCC ID (BM021): 2AMD3-BT021 Bluetooth (BQB) Bluetooth Product Listing Declaration ID (DID) D042707 https://launchstudio.bluetooth.com/ListingDetails/73996 Environmental RoHS RoHS compilant REACH REACH compilant 8.1 Federal Communications Commission (FCC) Statement Compliance Statement This device complies with part 15 of the FCC Rules.
Product Data Sheet BM021 FCC Interference Statement This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interfer-ence in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.
Product Data Sheet BM021 This device is intended only for OEM integrators under the following conditions: 1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and 2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required.
