User's Manual

Page 70
BitaTek Co., Ltd. Copyright protected. All rights reserved.
NO. 115 Wugong 3rd Rd., Tel [phone]
Wugu Dist., New Taipei City 248, Taiwan (R.O.C.) Fax[phone]
Charpt 7. Appendix
7.1. Abbreviations
Abbreviation
Description
BGA
Ball Grid Array
BLR
Board Level Reliability
DCE
Data Communication Equipment
DTE
Data Terminal Equipment
ENIG
Electroless Nickel Immersion Gold
LGA
Land Grid Array
PCB
Printed Circuit Board
RF
Radio Frequency
SMD
Surface Mount Device
SMT
Surface Mount Technology
TC
Thermocouples
TP
Test Point
UART
Universal Asynchronous Receiver-Transmitter
7.2. Mounting Advice Sheet
To prevent mechanical damage, be careful not to force, bend or twist the module. Be sure
it is soldered flat against the host device. The advice sheet on the follow shows a number
of examples for the kind of bending that may lead to mechanical damage of the module
(the module as part of an external application is integrated into a housing).