User's Manual

Page 51
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4.6.1. Preparation of LGA Module
It is recommended to use a vacuum lift system to pick up the desoldered module from the
application board. To secure a fixed connection between module shielding and module PCB,
additional glue points have to be provided.
4.6.2. Baking of Application Board
For a reliable desoldering process the moisture level has to taken into account. As known
from the soldering process, the moisture has to be limited to a certain level to avoid any
damages to components. Therefore, the complete application board including the module will
have to be baked before the desoldering process begins.
4.6.3. Removal of LGA Module
After preparation (glueing, baking) the module can be desoldered from the application board.
The desoldering temperature profile has to be selected that fits to the application and module
requirements (e.g., used solder paste, soldered components, PCBs). As recommended for
the LGA modules’ soldering process, the temperature profile should not exceed a
temperature of 245°C