User's Manual

Page 50
BitaTek Co., Ltd. Copyright protected. All rights reserved.
NO. 115 Wugong 3rd Rd., Tel [phone]
Wugu Dist., New Taipei City 248, Taiwan (R.O.C.) Fax[phone]
IEC60068-2-56
IEC60068-2-38
IEC60068-2-30
4
Thermal Shock
IEC60068-2-14
5
Vibration
IEC60068-2-6
IEC60068-2-59
6
Mechanical Shock
IEC60068-2-27
7
Micro Drop
IEC60068-2-32
8
ESD
IEC61000-4-2
9
Low temperature start test
IEC60068-2-1
10
High temperature start test
IEC60068-2-2
4.6. Desoldering Process
In case of persisting module issues, the module may be desoldered from the application
board. Desoldering however should only be the final means of diagnosis after all other
possible electrical on-board tests using the implemented test points were not successful.
The desoldering process is very similar to the employed soldering process, meaning that it is
quite specific for any type of external application.
The intention of desoldering is to provide a possibility to employ the standard RMA process.
Even if a further usage of the application board cannot be guaranteed (because of the
potential impact on neighboring components throughout the desoldering process), a high
reuse probability is expected, if the desoldering process is done in a professional manner.
There are a various types of desoldering machines available. The choice of a desoldering
machine (e.g., a Martin machine) strongly depends on the layout of the external application
board, the size and position of other components close to the module have an impact on the
temperature profile and type of heating.