User's Manual

Page 47
BitaTek Co., Ltd. Copyright protected. All rights reserved.
NO. 115 Wugong 3rd Rd., Tel [phone]
Wugu Dist., New Taipei City 248, Taiwan (R.O.C.) Fax[phone]
4.3. Soldering Conditions and Temperature
4.3.1. Reflow Profile
Profile Feature
Pb-Free Assembly
Preheat & Soak
Temperature Minimum (T
smin
)
Temperature Maximum (T
smax
)
Time (T
smin
to T
smax
) (t
S
)
150°C
200°C
60-120 seconds
Average ramp up rate (T
smax
to T
p
)
3K/second max.
Liquidous temperature (T
L
)
Time at liquidous (t
L
)
217°C
60-90 seconds
Peak package body temperature (T
p
)
245°C +0/-5°C
Time (t
P)
within 5 °C of the peak package body
temperature (T
P
)
30 seconds max.
Average ramp-down rate (TP to T
Smax
)
3 K/second max.