User's Manual

Page 46
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As an example and during Frey M1 internal tests, forced convection machines were able to
realize a good reflow soldering profile, so there was no need for using vapor phase
equipment.
For analyzing and adapting solder profiles a carrier board was prepared with thermocouples
(TC) .
In order to get a good overall performance the resulting voiding and the formation of
intermetallics as well as other thermal induced degradations must be well balanced. As
mentioned above a longer preheating phase can help gasses to escape from solder joints
before solidification. To not overstress the assembly, the complete reflow profile should be as
short as possible.
Here an optimization considering all components on the application must be performed. The
optimization of a reflow profile is a gradual process. It needs to be performed for every paste,
equipment and product combination. The presented profiles are only samples and valid for the
used pastes, reflow machines and test application boards. Therefore a "ready to use" reflow
profile can not be given.