User's Manual

Page 3
BitaTek Co., Ltd. Copyright protected. All rights reserved.
NO. 115 Wugong 3rd Rd., Tel [phone]
Wugu Dist., New Taipei City 248, Taiwan (R.O.C.) Fax[phone]
4.2.1. General Stencil Considerations ........................................... 44
4.2.2. Used Parameters and Recommendations ........................... 45
4.2.3. Pick and Place ..................................................................... 45
4.2.4. Reflow Profile ....................................................................... 45
4.3. Soldering Conditions and Temperature ............................... 47
4.3.1. Reflow Profile ....................................................................... 47
4.3.2. Maximum Temperature and Duration .................................. 48
4.4. Soldering Process Evaluation .............................................. 48
4.4.1. Visual Inspection .................................................................. 48
4.4.2. X-Ray Inspection and Void Content ..................................... 48
4.5. Board Level Reliability Investigation .................................... 49
4.6. Desoldering Process ............................................................ 50
4.6.1. Preparation of LGA Module ................................................. 51
4.6.2. Baking of Application Board ................................................. 51
4.6.3. Removal of LGA Module ...................................................... 51
Charpt 5. Packaging ............................................................................ 52
5.1. Mechanical Dimensions of Frey M1 ..................................... 52
5.2. Shipping Materials ............................................................... 54
5.2.1. Moisture Barrier Bag ............................................................ 56
5.3. Packing Label ...................................................................... 58
5.4. Storage Conditions .............................................................. 62
5.5. Moisture Sensitivity Level .................................................... 63
5.6. Durability and Mechanical Handling ..................................... 63
5.6.1. Storage Life ......................................................................... 63
5.6.2. Processing Life .................................................................... 63
5.6.3. Electrostatic Discharge ........................................................ 63
Charpt 6. Regulatory and Type Approval Information.......................... 64
6.1. Safety Precautions ............................................................... 66
6.2. Safety .................................................................................. 68
Charpt 7. Appendix .............................................................................. 70
7.1. Abbreviations ....................................................................... 70
7.2. Mounting Advice Sheet ........................................................ 70