User manual

3 Introduction
The reflow controller controls your reflow oven kit. To get the best soldering result,
specified times and temperatures must be maintained when soldering SMD components
using solder paste.
The reflow controller regulates your reflow oven in such a way that times and tempera-
tures are maintained and the optimum soldering result is achieved.
The boards and components are heated gradually during a preheat phase in order to
avoid mechanical stress in those elements.
Following the preheat phase, the temperature is raised to just below the soldering tem-
perature. In this way, the volatile components of the solder paste can escape with no
blistering.
The oven is then heated to the soldering temperature. The solder paste liquefies and the
components adhere to the board. The temperature is kept stable during the soldering
process in order to avoid damage through overheating.
The controller beeps to signal the end of the soldering phase.
The soldered board can now be removed from the oven.
You can adapt the solder curves to your own requirements. Up to five different curves
can be stored in the reflow controller.
Reflow Controller V3 PRO
Operating Instructions
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