Datasheet

www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_QP_3_0307
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: [phone]
Fax: [phone]
The Bergquist Company - Europe
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: [phone]
Fax: [phone]
The Bergquist Company - China
Rm. 7C,Aihe Mansion
No. 629 Ling Ling Road
Shanghai, China 200030
Ph: 86-21-6464-2206
Fax: [phone]
Q-Pad
®
3
Glass-Reinforced Grease Replacement Thermal Interface
Features and Benefits
• Thermal impedance:
0.35°C-in
2
/W (@50 psi)
• Eliminates processing constraints typically
associated with grease
• Conforms to surface textures
• Easy handling
• May be installed prior to soldering and
cleaning without worry
Bergquist Q-Pad 3 eliminates problems
associated with thermal grease such as con-
tamination of electronic assemblies and reflow
solder baths. Q-Pad 3 may be installed prior
to soldering and cleaning without worry.When
clamped between two surfaces, the elastomer
conforms to surface textures thereby creating
an air-free interface between heat-generating
components and heat sinks.
Fiberglass reinforcement enables Q-Pad 3 to
withstand processing stresses without losing
physical integrity. It also provides ease of
handling during application.
Typical Applications Include:
• Between a transistor and a heat sink
• Between two large surfaces such as an L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors,
transformers and solid state relays
Configurations Available:
• Sheet form, die-cut parts, and roll form
• With or without pressure sensitive adhesive
Building a Part Number Standard Options
Sil-Pad
®
: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
Q3 = Q-Pad 3 Material
Q3 0.005 AC 12/250 NA
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.005"
AC = Adhesive, one side
00 = No adhesive
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
––––
TYPICAL PROPERTIES OF Q-PAD 3
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Black Black Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (inch) / (mm) 0.005 0.127 ASTM D374
Hardness (Shore A) 86 86 ASTM D2240
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) Non-Insulating Non-Insulating ASTM D149
Dielectric Constant (1000 Hz) NA NA ASTM D150
Volume Resistivity (Ohm-meter) 10
2
10
2
ASTM D257
Flame Rating V-O V-O U.L.94
THERMAL
Thermal Conductivity (W/m-K) 2.0 2.0 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 2.26 1.99 1.76 1.53 1.30
Thermal Impedance (°C-in
2
/W) (1) 0.65 0.48 0.35 0.24 0.16
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only.Actual application performance is directly related to the surface roughness, flatness and pressure applied.