Datasheet

www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
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replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_SP_900S_0307
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: [phone]
Fax: [phone]
The Bergquist Company - Europe
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: [phone]
Fax: [phone]
The Bergquist Company - China
Rm. 7C,Aihe Mansion
No. 629 Ling Ling Road
Shanghai, China 200030
Ph: 86-21-6464-2206
Fax: [phone]
Sil-Pad
®
900S
High Performance Insulator for Low-Pressure Applications
Features and Benefits
• Thermal impedance:
0.61°C-in
2
/W (@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface
material solution
The true workhorse of the Sil-Pad product
family, Sil-Pad 900S thermally conductive
insulation material is designed for a wide
variety of applications requiring high thermal
performance and electrical isolation.These
applications also typically have low mounting
pressures for component clamping.
Sil-Pad 900S material combines a smooth
and highly compliant surface characteristic
with high thermal conductivity.These features
optimize the thermal resistance properties at
low pressures.
Applications requiring low component clamp-
ing forces include discrete semiconductors
(TO-220,TO-247 and TO-218) mounted with
spring clips. Spring clips assist with quick
assembly and apply a limited amount of force
to the semiconductor.The smooth surface
texture of Sil-Pad 900S minimizes interfacial
thermal resistance and maximizes thermal
performance.
Typical Applications Include:
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Configurations Available:
• Sheet form, die-cut parts, and roll form
• With or without pressure sensitive adhesive
Building a Part Number Standard Options
Sil-Pad
®
: U.S. Patents 4,574,879; 4,602,125; 4,602,678; 4,685,987; 4,842,911 and others
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
SP900S = Sil-Pad 900S Material
SP900S 0.009 AC 00 ACME 951753 Rev B
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.009"
AC = Adhesive, one side
00 = No adhesive
_ _ _ = Standard configuration dash number,
1212 = 12" x 12" sheets, 12/250 = 12" x 250' rolls, or
00 = custom configuration
––––
TYPICAL PROPERTIES OF SIL-PAD 900S
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Pink Pink Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (inch) / (mm) 0.009 0.229 ASTM D374
Hardness (Shore A) 92 92 ASTM D2240
Elongation (%45° to Warp andFill) 20 20 ASTM D412
Tensile Strength (psi) / (MPa) 1300 9 ASTM D412
Continuous Use Temp (°F) / (°C) -76 to 356 -60 to 180 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) 5500 5500 ASTM D149
Type 3 Electrodes 8300 8300 ASTM D149
Dielectric Constant (1000 Hz) 6.0 6.0 ASTM D150
Volume Resistivity (Ohm-meter) 10
10
10
10
ASTM D257
Flame Rating V-O V-O U.L.94
THERMAL
Thermal Conductivity (W/m-K) 1.6 1.6 ASTM D5470
THERMAL PERFORMANCE vs PRESSURE
Pressure (psi) 10 25 50 100 200
TO-220 Thermal Performance (°C/W) 3.96 3.41 2.90 2.53 2.32
Thermal Impedance (°C-in
2
/W) (1) 0.95 0.75 0.61 0.47 0.41
1) The ASTM D5470 test fixture was used.The recorded value includes interfacial thermal resistance.These values are provided for
reference only.Actual application performance is directly related to the surface roughness, flatness and pressure applied.