Datasheet

www.bergquistcompany.com
All statements, technical information and recommendations herein are based on tests we believe to be reliable, and
THE FOLLOWING IS MADE IN LIEU OF ALL WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED
WARRANTIES OF MARKETABILITY AND FITNESS FOR PURPOSE. Sellers’ and manufacturers’ only obligation shall be to
replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
for its intended use, and the user assumes all risks and liability whatsoever in connection therewith. NEITHER SELLER NOR
MANUFACTURER SHALL BE LIABLE EITHER IN TORT OR IN CONTRACT FOR ANY LOSS OR DAMAGE, DIRECT,
INCIDENTAL, OR CONSEQUENTIAL, INCLUDING LOSS OF PROFITS OR REVENUE ARISING OUT OF THE USE OR
THE INABILITY TO USE A PRODUCT. No statement, purchase order or recommendations by seller or purchaser not
contained herein shall have any force or effect unless in an agreement signed by the officers of the seller and manufacturer.
PDS_10069_GP_VOS_0305
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: [phone]
Fax: [phone]
The Bergquist Company - Europe
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: [phone]
Fax: [phone]
The Bergquist Company - China
Rm. 7C, Aihe Mansion
No. 629 Ling Ling Road
Shanghai, China 200030
Ph: 86-21-6464-2206
Fax: [phone]
Features and Benefits
• Thermal conductivity: 0.8 W/m-K
• Conformable, low hardness
• Enhanced puncture, shear and tear resistance
• Electrically isolating
Gap Pad VO Soft is recommended for
applications that require a minimum amount
of pressure on components. Gap Pad VO
Soft is a highly conformable, low-modulus,
filled-silicone polymer on a rubber-coated
fiberglass carrier.The material can be used
as an interface where one side is in contact
with a leaded device.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Gap Pad VO Soft
®
Highly Conformable,Thermally Conductive Material for Filling Air Gaps
1234 8765910
200
180
160
140
120
100
80
60
40
20
Thickness vs. Thermal Resistance
Gap Pad VO Soft
Thermal Resistance (°C-in
2
/W)
Resultant Thickness (mils)
Typical Applications Include:
• Telecommunications
• Computer and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
Configurations Available:
• Sheet form and die-cut parts
Building a Part Number Standard Options
Gap Pad
®
:U.S. Patent 5,679,457 and others.
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GPVOS = Gap Pad VO Soft Material
GPVOS 0.060 AC 00 ACME10256 Rev. a
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.020", 0.040", 0.060",
0.080", 0.100", 0.125", 0.160", 0.200"
AC = Pressure sensitive adhesive, one side
00 = No pressure sensitive adhesive
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
––––
TYPICAL PROPERTIES OF GAP PAD VO SOFT
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Mauve/Pink Mauve/Pink Visual
Reinforcement Carrier Sil-Pad Sil-Pad —
Thickness (inch) / (mm) 0.020 to 0.200 0.508 to 5.080 ASTM D374
Inherent Surface Tack (1- or 2-sided) 1 1 —
Density (g/cc) 1.6 1.6 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1) 25 25 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 40 275 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >6000 >6000 ASTM D149
Dielectric Constant (1000 Hz) 5.5 5.5 ASTM D150
Volume Resistivity (Ohm-meter) 10
11
10
11
ASTM D257
Flame Rating V-O V- O U.L. 94
THERMAL
Thermal Conductivity (W/m-K) 0.8 0.8 ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch
2
. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.