Datasheet

www.bergquistcompany.com
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replace such quantity of the product proved to be defective. Before using, user shall determine the suitability of the product
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PDS_10050_GP_3000S30_0305
The Bergquist Company -
North American Headquarters
18930 West 78th Street
Chanhassen, MN 55317
Phone: [phone]
Fax: [phone]
The Bergquist Company - Europe
Bramenberg 9a, 3755 BT Eemnes
Netherlands
Phone: [phone]
Fax: [phone]
The Bergquist Company - China
Rm. 7C,Aihe Mansion
No. 629 Ling Ling Road
Shanghai, China 200030
Ph: 86-21-6464-2206
Fax: [phone]
Gap Pad
®
3000S30
Features and Benefits
• Thermal conductivity: 3.0 W/m-K
• Low “S-Class” thermal resistance at very
low pressures
• Highly conformable,“S-Class” softness
• Designed for low-stress applications
• Fiberglass reinforced for puncture, shear
and tear resistance
Gap Pad 3000S30 is a soft gap filling material
rated at a thermal conductivity of 3 W/m-K.
The material offers exceptional thermal
performance at low pressures due to an all-
new 3 W/m-K filler package and low-modulus
resin formulation. It is reinforced to enhance
material handling, puncture, shear and tear
resistance. It is well suited for high perform-
ance, low-stress applications that typically use
fixed standoff or clip mounting.A conformable
yet elastic nature that allows for excellent
interfacing and wet-out characteristics, even
to rough surfaces and/or topography.
Gap Pad 3000S30 is offered with natural
inherent tack on both sides of the material,
eliminating the need for thermally-impeding
adhesive layers.The material’s natural inherent
tack allows for stick-in-place characteristics
during assembly. Gap Pad 3000S30 is supplied
with protective liners on both sides.
Note: Resultant thickness is defined as the final gap
thickness of the application.
Thermally Conductive, Reinforced, Soft “S-Class” Gap Filling Material
Typical Applications:
• Processors • Notebook computers
• Server S-RAMs • BGA packages
• Mass storage drives • Power conversion
• Wireline/wireless communications hardware
Configurations Available:
• Sheet form and die-cut parts available
Building a Part Number Standard Options
Gap Pad
®
: U.S. Patent 5,679,457 and others.
Section A
Section B
Section C
Section D
Section E
NA = Selected standard option. If not selecting a standard
option, insert company name, drawing number, and
revision level.
GP3000S30 = Gap Pad 3000S30 Material
GP3000S30 0.020 02 0816 ACME 89302 Rev a
Note: To build a part number, visit our website at www.bergquistcompany.com.
Standard thicknesses available: 0.010", 0.015", 0.020",
0.040", 0.060", 0.080", 0.100", 0.125"
02 = Natural tack, both sides
0816 = Standard sheet size 8" x 16", or
00 = custom configuration
––––
0.10 1.701.501.301.100.900.700.500.30
130
110
90
70
50
30
10
Thickness vs. Thermal Resistance
Gap Pad 3000S30
Thermal Resistance
(
°C-in
2
/W
)
Resultant Thickness (mils)
TYPICAL PROPERTIES OF GAP PAD 3000S30
PROPERTY IMPERIAL VALUE METRIC VALUE TEST METHOD
Color Light Blue Light Blue Visual
Reinforcement Carrier Fiberglass Fiberglass —
Thickness (inch) / (mm) 0.010 to 0.125 0.254 to 3.175 ASTM D374
Inherent Surface Tack (1- or 2-sided) 2 2 —
Density (g/cc) 3.2 3.2 ASTM D792
Heat Capacity (J/g-K) 1.0 1.0 ASTM E1269
Hardness 40-125 mil (Shore 00) (1) 30 30 ASTM D2240
Young’s Modulus (psi) / (kPa) (2) 26 180 ASTM D575
Continuous Use Temp (°F) / (°C) -76 to 392 -60 to 200 —
ELECTRICAL
Dielectric Breakdown Voltage (Vac) >3000 >3000 ASTM D149
Dielectric Constant (1000 Hz) 7.0 7.0 ASTM D150
Volume Resistivity (Ohm-meter) 10
9
10
9
ASTM D257
Flame Rating V-O V-O U.L.94
THERMAL
Thermal Conductivity (W/m-K) 3.0 3.0 ASTM D5470
1) Thirty second delay value Shore 00 hardness scale.
2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch
2
. For more information on Gap Pad
modulus, refer to Bergquist Application Note #116.