Datasheet

PRODUCT SPECIFICATION
REVISION: ECR/ECN NUMBER: DOCUMENT NUMBER SHEET No.
1
EK2017-0***
PS-80397-001
7 of 11
DATE: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
2017 / 05/ 22
Eric Bai
TEMPLATE FILENAME: PRODUCT_SPEC
REV 0.1,SHEET
SIZE
A4
20070830
18 Mixed Flowing Gas
Subject mated connectors into the
chamber, the connector shall be mounted
on appropriate LLCR boards
and exposed to:
a) Relative Humidity: 70%+/-2% b)
Temperature: 30℃+/-1℃ c) Duration: 7
days.
d) Invironmental Class: IIA (EIA-364-
65.)
No physical damage.
Contact Resistanc：
50 mΩ Max.
19 Salt Spray
The mated connectors shall be exposed to
the following salt mist conditions. At the
completion of the exposure period, salt
deposits shall be removed by a gentle
wash or dip in running water, after which
the specified measurements shall be
performed.
NaCl solution concentration: 5±1%, Spray
time: 48 hours, Temperature:35±2℃.
PER EIA-364-26B CONDITION B
No physical damage
&10 milliohms MAX.
(change from initial)
20
Thermal
Disturbance
5 °C for 5 min
Upper-Ramp: 35 min (2°C/min)
85 °C for 5 min
Down-Ramp:35min (2°C/min)
Humidity: Not be controlled.
Total : 10 cycles. (13.3hrs)
No physical damage.
Contact Resistanc：
50 mΩ Max.
21
Solderability
EIA364
-
52
Soldering Time:3 +/-0.5sec
Soldering Temperature:245+3/-3℃
Immersion in the soldering bath at 0.5mm
From terminal tip
NO damage.
Minimum: 95 % of
immersed area.
22
Soldering Heat
Reflow soldering method
Refer to below Graph
Soldering iron method
Soldering time:10+/-0.5sec.
Soldering Temperature : 260+0/-2℃
0.5mm from terminal tip and fitting
nail(mounted ear) tip
No physical damage or
discoloration of connector
materials.
IR REFLOW: