Datasheet

PRODUCT SPECIFICATION
REVISION: ECR/ECN NUMBER: DOCUMENT NUMBER SHEET No.
B
.1
EK2017-0028
PS-70094-001
9 of 11
DATE: CREATED / REVISED BY: CHECKED BY: APPROVED BY:
201
7
/
0
2
/
0
7
Kevin Miao
Ivanov
Wang
Ivanov
Wang
Form No.: QR-QP025-15 REV.: A
6.2 IR PROFILE
Recommended Reflow Pre-Solder Process and Profile.
Actual reflow profile also depends on equipment, solder paste, PCB thickness, and other
components on the board. Please consult your solder paste & reflow equipment manufacturer for
their recommendations to adopt a suitable process.
Notes :
1. Reflow solder preheat at 3°C/s to 150°C.
2. Reflow at 255°C for 30s per figure.
3. Peak temperature to be at 260 +0/-5°C.
260°C Max 10 second/cycles 2 cycles(Peak Temperature)