Data Sheet
Surface Mount PTC
0ZC
M
Series
belfuse.com/
circuit
-
protection
0ZC
M
Series
–
0
603
Chip
RoHS 2 Compliant
Application
All high
-
density boards
Product Features
-
0603 Chip Size
, Fas
t Trip Time, Low DCR Resistance
-
AEC
-
Q
Compliant
-
Meets Bel a
utomotive qualification*
*
-
Largely bas
ed on internal AEC
-
Q test plan
Operating (Hold Current) Range
5
0mA
–
200m
A
Maximum Voltage
9
-
15
V (per table)
Temperature Range
-
40
℃
to 85
℃
Agency Approval
TUV (Std. EN60738
-
1
-
1, Cert. R50102117)
UL Recognized Component
(Std. UL1434, File E305051)
UL Conditions of
Acceptability:
1. These devices have been investigated for use in safety circuits and are suitable
as a limiting device.
2. These devices have been calibrated to limit the current to 8 amps within 5
seconds, per ANSI/NFPA 70, “National Electrical
Code”.
LEAD FREE =
HALOGEN FREE =
Electrical Characteristics (23
℃
)
Part Number
Hold
Current
Trip
Current
Rated
Voltage
Maximum
Current
Typical
Power
Max
Time to Trip
Resistance Tolerance
Agency Approvals
Current
Time
R
min
R1
max
I
H
, A
I
T
, A
V
max
, V
dc
I
max
, A
P
d
, W
A
Sec
Ohms
Ohms
A
0ZCM0005FF2G
0.05
0.15
15
40
0.5
0.50
0.10
3.80
30.00
Y
Y
B
0ZCM0008FF2G
0.08
0.20
15
40
0.5
0.60
0.10
2.80
14.00
Y
Y
0ZCM0008FA2G
0.08
0.20
15
40
0.5
0.60
0.10
2.80
14.00
Y
C
0ZCM0010FF2G
0.10
0.25
15
40
0.5
0.70
0.10
0.90
8.00
Y
Y
D
0ZCM0012FF2G
0.12
0.30
9
40
0.5
0.80
0.10
1.10
5.80
Y
Y
E
0ZCM0016FF2G
0.16
0.40
9
40
0.5
1.00
0.10
1.00
4.20
Y
Y
F
0ZCM0020FF2G
0.20
0.45
9
40
0.5
2.00
0.10
0.55
3.50
Y
Y
I
H
Hold Current
-
maximum current at which the device will not trip in still air at 23
℃
.
I
T
Trip current
-
minimum current at which the device will always trip in still air at 23
℃
.
I
max
Maximum fault current device can withstand without damage at rated voltage (Vmax).
V
max
Maximum voltage device can withstand without damage a
t its rated current.
Pd
Typical power dissipated by device when in tripped state in 23
℃
still air en
vironment.
R
min
Minimum device resistance at 23
℃
.
R1
max
Maximum device resistance at 23
℃
, 1 hour after initial device trip, or after being soldered to PCB in end application.
Spe
cifications subject to change without notice
AEC
-
Q
Compliant




