User's Guide
Table Of Contents
- XBee/XBee-PRO S2C 802.15.4 RF Module User Guide
- Technical specifications
- Hardware
- Configure the XBee/XBee-PRO S2C 802.15.4 RF Module
- Modes
- Operation
- AT commands
- Special commands
- Networking and security commands
- C8 (802.15.4 Compatibility)
- CH (Operating Channel)
- ID (Network ID)
- DH (Destination Address High)
- DL (Destination Address Low)
- MY (Source Address)
- SH (Serial Number High)
- SL (Serial Number Low)
- MM (MAC Mode)
- RR (XBee Retries)
- RN (Random Delay Slots)
- ND (Network Discovery)
- NT (Node Discover Timeout)
- NO (Node Discovery Options)
- DN (Discover Node)
- CE (Coordinator Enable)
- SC (Scan Channels)
- SD (Scan Duration)
- A1 (End Device Association)
- A2 (Coordinator Association)
- AI (Association Indication)
- DA (Force Disassociation)
- FP (Force Poll)
- AS (Active Scan)
- ED (Energy Detect)
- EE (Encryption Enable)
- KY (AES Encryption Key)
- NI (Node Identifier)
- NP (Maximum Packet Payload Bytes)
- RF interfacing commands
- Sleep commands
- Serial interfacing commands
- I/O settings commands
- D0 (DIO0/AD0)
- D1 (DIO1/AD1)
- D2 (DIO2/AD2)
- D3 (DIO3/AD3)
- D4 (DIO4)
- D5 (DIO5/ASSOCIATED_INDICATOR)
- D8 (DIO8/SLEEP_REQUEST)
- P0 (RSSI/PWM0 Configuration)
- P1 (PWM1 Configuration)
- P2 (SPI_MISO)
- M0 (PWM0 Duty Cycle)
- M1 (PWM1 Duty Cycle)
- P5 (SPI_MISO)
- P6 (SPI_MOSI Configuration)
- P7 (SPI_SSEL )
- P8 (SPI_SCLK)
- P9 (SPI_ATTN)
- PR (Pull-up/Down Resistor Enable)
- PD (Pull Up/Down Direction)
- IU (I/O Output Enable)
- IT (Samples before TX)
- IS (Force Sample)
- IO (Digital Output Level)
- IC (DIO Change Detect)
- IR (Sample Rate)
- RP (RSSI PWM Timer)
- I/O line passing commands
- Diagnostic commands
- Command mode options
- Operate in API mode
- API mode overview
- API frame specifications
- Escaped characters in API frames
- Frame descriptions
- TX Request: 64-bit address frame - 0x00
- TX Request: 16-bit address - 0x01
- AT Command frame - 0x08
- AT Command - Queue Parameter Value frame - 0x09
- Remote AT Command Request frame - 0x17
- RX Packet: 64-bit Address frame - 0x80
- Receive Packet: 16-bit address frame - 0x81
- RX (Receive) Packet: 64-bit address IO frame- 0x82
- RX Packet: 16-bit address I/O frame - 0x83
- AT Command Response frame - 0x88
- TX Status frame - 0x89
- Modem Status frame - 0x8A
- Remote Command Response frame - 0x97
- Regulatory information
- Load 802.15.4 firmware on ZB devices
- Migrate from XBee through-hole to surface-mount devices
- PCB design and manufacturing
Regulatory information Europe (CE)
XBee/XBee-PRO S2C 802.15.4 RF Module User Guide
145
2.8 Label and compliance information
Host product manufacturers need to follow the sticker guidelines outlined in OEM labeling
requirements.
2.9 Information on test modes and additional testing requirements
Contact a Digi sales representative for information on how to configure test modes for the
XBee/XBee-PRO S2C 802.15.4 RF Module.
2.10 Additional testing, Part 15 Subpart B disclaimer
All final host products must be tested to be compliant to FCC Part 15 Subpart B standards. While the
XBee/XBee-PRO S2C 802.15.4 module was tested to be complaint to FCC unintentional radiator
standards, FCC Part 15 Subpart B compliance testing is still required for the final host product. This
testing is required for all end products, and XBee/XBee-PRO S2C 802.15.4 module Part 15 Subpart B
compliance does not affirm the end product’s compliance.
See FCC notices for more details.
Europe (CE)
The XBee/XBee-PRO S2C 802.15.4 RF Modules (non-PRO variants)have been tested for use in several
European countries. For a complete list, refer to www.digi.com/resources/certifications.
If XBee/XBee-PRO S2C 802.15.4 RF Modules are incorporated into a product, the manufacturer must
ensure compliance of the final product with articles 3.1a and 3.1b of the Radio Equipment Directive. A
Declaration of Conformity must be issued for each of these standards and kept on file as described in
the Radio Equipment Directive.
Furthermore, the manufacturer must maintain a copy of the XBee/XBee-PRO S2C 802.15.4 RF Module
user guide documentation and ensure the final product does not exceed the specified power ratings,
antenna specifications, and/or installation requirements as specified in the user guide.
Maximum power and frequency specifications
For the through-hole device:
n Maximum power: 9.82 mW (9.92 dBm) Equivalent Isotropically Radiated Power (EIRP)at normal
condition.
n Frequencies: 5 MHz channel spacing, beginning at 2405 MHz and ending at 2480 MHz.
For the surface-mount device:
n Maximum power: 12.65 mW (11.02 dBm) EIRP.
n Frequencies: 5 MHz channel spacing, beginning at 2405 MHz and ending at 2480 MHz.
OEM labeling requirements
The “CE” marking must be affixed to a visible location on the OEM product. The following figure shows
CE labeling requirements.