User`s manual

Manual Revision Information

Reversion Revision History Date

1.03 Release September 2000

Item Checklist

R BC133KT-100

R Cable for IDE/Floppy

R CD for motherboard utilities and BC133KT-100 User’s Manual

 Cable for USB Port 3/4 (Option)

 Cable for COM2 (Option)

R BC133KT-100 Quick Start Card

 Norton Antivirus CD (Option)

AMD-Duron™ Processor Family

Cooling Solutions

As processor technology pushes to faster speeds and higher performance, thermal management

becomes increasingly crucial when building computer systems. Maintaining the proper thermal

environment is key to reliable, long-term system operation. The overall goal in providing the

proper thermal environment is keeping the processor below its specified maximum case

temperature. Heatsinks induce improved processor heat dissipation through increased surface

area and concentrated airflow from attached fans. In addition, interface materials allow

effective transfers of heat from the processor to the heatsink. For optimum heat transfer, AMD

recommends the use of thermal grease and mounting clips to attach the heatsink to the

processor.

When selecting a thermal solution for your system, please refer to the website below for

collection of heatsinks evaluated and recommended by AMD for use with AMD processors.

Note, those heatsinks are recommended for maintaining the specified Maximum T case

requirement. In addition, this collection is not intended to be a comprehensive listing of all

heatsinks that support AMD processors.

For vendor list of heatsink and fan, please visit

http://www1.amd.com/products/duron/thermals