Datasheet

ManualsBrandsBARTHELME ManualsLEDs & AccessoriesSMD LED PLCC2 Daylight white 2200 mcd 120 ° 20 mA 2.9 V

Absolute Maximum Ratings at TA=25°C（Single input）　

Features

.Small size(3.5x2.8x1.9mm)

.Industry Standard Footprint

.Compatible in 8mm tape on 178mm

Diameter Reels

.Low Profile

.Several Colors Available

PRELIMINARY

Precautions：

These products are sensitive to static electricity; high standard of care must be fully

taken when handling them. Particularly if an over-voltage that exceeds the Absolute

maximum Rating of these products were applied, the overflow energy will cause

damage to and possibly result in destruct

ion of these products. Buyer shall take

absolute secure countermeasures against static electricity and surge when handling

these products.

Electrical/Optical Characteristics at TA=25

REFLOW SOLDERING TEMP. …………………...... 260°C FOR 4 SEC

STORAGE TEMPERATURE RANGE........................-40°C TO +100°C

OPERATING TEMPERATURE RANGE.........................-30°C to 85°C

PULSE CURRENT (1/10 Duty Cycla,0.1 ms Pulse Width)………... 100 mA

D.C.FORWARD CURRENT............................................................ 30mA

3.5x2.8x1.9 mm TOP LED

REVERSE VOLTAGE (<100 uA).......................................................5.0V

Part

Number

LED CHIP

Forward voltage

@20mA

Reverse

Current

color tem-

perature

Luminous In-

tesity @20mA

View

Angle

Material

Emitting

Color

Min Max Ir(Vr=5V) Typ Typ. Typ

61000115 InGaN

tages-

licht/

daylight

2,9 3,6 50uA 6300K 2200mcd 120°

Summary of content (7 pages)

PAGE 1
3.5x2.8x1.9 mm TOP LED Absolute Maximum Ratings at TA=25°C（Single input） Features .Small size(3.5x2.8x1.9mm) .Industry Standard Footprint .Compatible in 8mm tape on 178mm Diameter Reels .Low Profile .Several Colors Available REVERSE VOLTAGE (<100 uA).......................................................5.0V D.C.FORWARD CURRENT............................................................ 30mA PULSE CURRENT (1/10 Duty Cycla,0.1 ms Pulse Width)………... 100 mA OPERATING TEMPERATURE RANGE......................
PAGE 2
Electrical And Optical Characteristics Curve Relative Luminous Intensity (%) Wavelength (nm) FIG.1 SPECTRUM (If=20mA) Forward Current IF = f ( VF ) Relative Luminous Intensity Iv/Iv (20mA) = f ( IF) (mA) IF Iv VF ( V ) FIG.2 FORWARD CURRENT VS. FORWARD VOLTAGE Allowable Forward Current IF ( mA ) FIG.3 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT Radiation Angle (mA) IF TA temp. ambient TA( ° C ) FIG.4 ALLOWABLE FORWARD CURRENT VS. AMBIENT TEMPERATURE Relative Luminous Intensity FIG.
PAGE 3
.5x2.8x1.9 mm TOP LED Unit:mm Tolerance:±0.1 The following soldering patterns are recommended for reflow soldering. Dimensions. (unit : mm) SEC:B-B Reel & Packing specification.
PAGE 4
RELIABILITY TEST ITEMS AND RESULTS Test Item Resistance to Soldering JEITA ED-4701 Heat (Reflow Soldering) 300-301 Solderability JEITA ED-4701 (Reflow Soldering) 300-303 MIL-STD 202-107D Thermal Shock MIL-STD 705-1051 MIL=STD 808-1011 Temperature Cycle Moisture Resistance Cyclic JEITA ED-4701 100-105 JEITA ED-4701 200-203 Test Conditions Note Number of Damaged Tald=260±５℃ ４ｓｅｃ（ＬｅａｄｆｒｅｅＳｏｌｄｅｒ） 2 times 0/50 Tald=21５±５℃ ３ｓｅｃ（ＬｅａｄＳｏｌｄｅｒ） 1 time over 95% 0/50 0℃ －１００℃ １５ｓｅｃ．１５ｓｅｃ 20cy
PAGE 5
Warning 1. Storage After open the package, the SMD LED should be kept at 28 °C, 60%RH or less. The SMD LED should be soldered with in 7 days after opening the package. Heat generation must be taken into design consideration when using the SMD LED. 2. Cleaning Use IPA as a solvent for cleaning the SMD LED. The other solvent may dissolve the SMD LED package and the epoxy, ultrasonic cleaning should not be done. 3.
PAGE 6
Lead-free Temperature Profile Application(Soldering) Manual soldering (We do not recommend this method strongly.) Soldering tin material: tin 6/4 alloy or contained Ag. To prevent cracking, please bake before manual soldering. keep the temperature on the edge of iron at 300 ℃ Max.(25W)and apply for 3 seconds.If the temperature become higher,apply in a shorter time (1sec) In manual soldering, take care not to damage the package especially terminal or resin. (Do not give stress to the product when soldering.
PAGE 7
SURFACE MOUNT CHIP LED SPECIFICATION Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be taken not to overload LEDs with instataneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs.