User's Manual

Table 14. Flash SPI slave characteristics

Figure 6. Flash programming interface timing

Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure

to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.

Note 2: ESD (electrostatic discharge) sensitive device. ESD protection devices are used extensively internal to WSM2400.

However, high electrostatic discharge can damage or degrade the device. Use proper ESD handling precautions.

Note 3: Extended storage at high temperature is discouraged, as this negatively affects the data retention of WSM2400’s

calibration data. See the FLASH Data Retention section for details.

Note 4: Actual RF range is subject to a number of installation-specific variables including, but not restricted to ambient

temperature, relative humidity, presence of active interference sources, line-of-sight obstacles, and near-presence of objects

(for example, trees, walls, signage, and so on) that may induce multipath fading. As a result, range varies.

Note 5: As Specified by IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications

for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/findstds/standard/802.15.4-2011.html.

Note 6: IEEE Std. 802.15.4-2006 requires transmitters to maintain a frequency tolerance of better than ±40 ppm.