User's Manual

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1-2. KEY FEATURES
High Performance Integrated MCU
• ARM Cortex-M3 running up to 200MHz
• 1MB QSPI Flash in Package
• 512 KB on-chip SRAM; 4KB retention RAM
IO Interfaces
• QSPI (1) SSP/SPI/I2S (3), I2C (2), UART (3)
• USB OTG (FS) with integrated PHY
• ADC, DAC, Analog Comparator, Temp Sensor
MCU Sub-System
• RTC, WDT, GPT, PWM, CRC, AES (128-bit)
• JTAG
Wireless Sub-System
• Wi-Fi 802.11 b/g/n HT20
• Bluetooth 4.0 (Supports Low Energy(LE))
• Integrated Chip-Antenna
High Integration and Low-RBOM
• Single 3.3V Power Input
Certifications
• FCC/CE (others to be done as needed)
• Wi-Fi & Bluetooth (via Marvell)
Package
• LGA Module – 18 mm x 36 mm x 2.5mm 110 pin
Antenna
• Support Chip Antenna for Internal Antenna
• Support U.FL Connector for External Antenna
• Antenna Switching for Internal/External Antenna without diversity