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IEEE 802.11 b/g/n + Bluetooth 4.0 HS Smart Energy Module
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4.
MECH
A
N
IC
AL
CH
ARACTER
ISTICS
The size and thic
k
ness of the A
W
-CU277 LGA packa
ge module is listed
below:
AW
-CU277 TOP View PCB Lay
out Footprint
A
B
C
D
E
F
G
H
J
K
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1
...
...
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13
14
...
...
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