Data Sheet

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2. Ground Layout
Please follow general ground layout guidelines. Here are some general rules for customers’
reference.
• The layer 2 of PCB should be a complete ground plane. The rule has to be obeyed strictly in
the RF section while RF traces are on the top layer.
• Each ground pad of components on top layer should have via drilled to PCB layer 2 and via
should be as close to pad as possible. A bulk decoupling capacitor needs two or more.
• Don’t place ground plane and route signal trace below printed antenna or chip antenna to
avoid destroying its electromagnetic field, and there is no organic coating on printed antenna.
Check antenna chip vendor for the layout guideline and clearance.
• Move GND vias close to the pads.
3. Power Layout
Please follow general power layout guidelines. Here are some general rules for customers’
reference.
• A 4.7uF capacitor is used to decouple high frequency noise at digital and RF power terminals.
This capacitor should be placed as close to power terminals as possible.
• In order to reduce PCB’s parasitic effects, placing more via on ground plane is better.
4. Digital Interface
Please follow power and ground layout guidelines. Here are some general rules for customers’
reference.
• The digital interface to the module must be routed using good engineering practices to
minimize coupling to power planes and other digital signals.
• The digital interface must be isolated from RF trace.
5. RF Trace
The RF trace is the critical to route. Here are some general rules for customers’ reference.
• The RF trace impedance should be 50Ω between ANT port and antenna matching network.
• The length of the RF trace should be minimized.
• To reduce the signal loss, RF trace should laid on the top of PCB and avoid any via on it.