Datasheet

Substance 3 Copper Supplier 7440-50-8 0.07 1.0 0.03878 mg
Substance 3 Titanium Supplier 7440-32-6 0.0070 1.0 0.003878 mg
Substance 3 Arsenic Supplier 7440-38-2 0.01 1.0 0.00554 mg
Substance 3 Chromium Supplier 7440-47-3 0.06 1.0 0.03324 mg
Substance 3 Nickel Nickel 7440-02-0 0.07 1.0 0.03878 mg
Substance 3 Cadmium Cadmium/Cad
mium
Compounds
7440-43-9 0.01 1.0 0.00554 mg
Substance 3 Mercury Mercury/Mercu
ry Compounds
7439-97-6 5.0E-4 1.0 2.77E-4 mg
Substance 3 Lead Lead/Lead
Compounds
7439-92-1 0.1 1.0 0.0554 mg
Sub-Item 1 E2061 RK-
Band
contacted
IM..D
1.0 144.632 mg
Material 2 Sputter layer 1.0 0.06167561 mg
Substance 3 Silver Supplier 7440-22-4 2.0 1.0 0.00123351 mg
Substance 3 Gold Supplier 7440-57-5 98.0 1.0 0.0604421 mg
Material 2 Intermediate
Layer
1.0 1.00531456 mg
Substance 3 Nickel Nickel 7440-02-0 20.0 1.0 0.20106 mg
Substance 3 Silver Supplier 7440-22-4 80.0 1.0 0.80425 mg
Material 2 Copper Alloy 1.0 61.14 mg
Substance 3 Lead Lead/Lead
Compounds
7439-92-1 0.05 1.0 0.03057 mg
Substance 3 Zinc Supplier 7440-66-6 1.0 1.0 0.6114 mg
Substance 3 Silicon Supplier 7440-21-3 1.2 1.0 0.73368 mg
Substance 3 Cobalt Supplier 7440-48-4 0.1 1.0 0.06114 mg
Substance 3 Copper Supplier 7440-50-8 92.7685 1.0 56.71866 mg
Substance 3 Chromium Supplier 7440-47-3 0.06 1.0 0.036684 mg
Substance 3 Beryllium Supplier 7440-41-7 0.0010 1.0 6.114E-4 mg
Substance 3 Magnesium Supplier 7439-95-4 0.3 1.0 0.18342 mg
Substance 3 Manganese Supplier 7439-96-5 0.1 1.0 0.06114 mg
Substance 3 Iron Supplier 7439-89-6 0.2 1.0 0.12228 mg
Substance 3 Arsenic Supplier 7440-38-2 0.0050 1.0 0.003057 mg
Substance 3 Antimony Supplier 7440-36-0 0.01 1.0 0.006114 mg
Substance 3 Nickel Nickel 7440-02-0 4.2 1.0 2.56788 mg
Substance 3 Cadmium Cadmium/Cad
mium
Compounds
7440-43-9 0.0050 1.0 0.003057 mg
Substance 3 Mercury Mercury/Mercu
ry Compounds
7439-97-6 5.0E-4 1.0 3.057E-4 mg
Material 2 LCP-GF30 1.0 40.19 mg
Substance 3 1,4-
Benzenedicarb
oxylic acid,
polymer with
[1,1-biphenyl]-
4,4-diol, 4-
hydroxybenzoi
c acid, 6-
hydroxy-2-
naphthalenecar
boxylic acid
and N-(4-
hydroxyphenyl)
acetamide
Supplier 147310-94-9 66.6 1.0 26.76654 mg
Substance 3 Contains No
Reportable
TE5081-2
Substances
Supplier TE5081-2-
1212
0.4 1.0 0.16076 mg
Substance 3 Glass, oxide,
chemicals
Supplier 65997-17-3 33.0 1.0 13.2627 mg
Material 2 Nickel Plate 1.0 18.0 mg
Substance 3 Contains No
Reportable
TE5081-2
Substances
Supplier TE5081-2-
1212
0.2 1.0 0.036 mg
Substance 3 Lead Lead/Lead
Compounds
7439-92-1 0.1 1.0 0.018 mg
Substance 3 Nickel Nickel 7440-02-0 99.7 1.0 17.946 mg
Material 2 Gold Plate 1.0 13.02 mg
Substance 3 Gold Supplier 7440-57-5 99.7 1.0 12.98094 mg
Substance 3 Contains No
Reportable
TE5081-2
Substances
Supplier TE5081-2-
1212
0.3 1.0 0.03906 mg
Material 2 Palladium plate 1.0 10.0 mg
Substance 3 Palladium Supplier 7440-05-3 100.0 1.0 10.0 mg
Material 2 Base layer 1.0 1.21500982 mg
Substance 3 Copper Supplier 7440-50-8 68.4 1.0 0.83107 mg
Substance 3 Manganese Supplier 7439-96-5 0.6 1.0 0.00729006 mg