Datasheet
108-98001 Rev. G
All specications subject to change. Consult Tyco Electronics for latest specications. 11 of 15
Telecom-, Signal and RF Relays
IM Relay
AXICOM
Insulation
Standard, Sen-
sitive, Ultra High
Sensitive Version
„C“ Version
High Dielectric
„D“ Version
High Current
Insulation resistance at 500 Vdc > 10
9
Ω > 10
9
Ω > 10
9
Ω
Dielectric test voltage (1 min)
between coil and contacts
between adjacent contact sets
between open contacts
1800 Vrms
1000 Vrms
1000 Vrms
1800 Vrms
1800 Vrms
1500 Vrms
1500 Vrms
750 Vrms
750 Vrms
Surge voltage resistance
according to Telcordia TR-NWT-001089 (2/10 µs)
between coil and contacts
between adjacent contact sets
between open contacts
according / EC 60950 (10/ 700 µs)
between coil and contacts
between adjacent contact sets
between open contacts
2500 V
1500 V
1500 V
2500 V
1500 V
1500 V
2500 V
2500 V
2500 V
2500 V
2500 V
2500 V
2000 V
1000 V
1000 V
2000 V
1000 V
1000 V
High Frequency Data
Capacitance
between coil and contacts
between adjacent contact sets
between open contacts
max. 2 pF
max. 2 pF
max. 1 pF
RF Characteristics
Isolation at 100 MHz / 900 MHz
Insertion loss at 100 MHz / 900 MHz
V.S.W.R. at 100 MHz / 900 MHz
- 37.0 dB / - 18.8 dB
- 0.03 dB / - 0.33 dB
1.06 / 1.49
General Data
Operate time at U
nom
typ. / max. 1 ms / 3 ms
Reset time (latching) at U
nom
, typ. / max. 1 ms / 3 ms
Release time without diode in parallel (non-latching), typ. /
max.
1 ms / 3 ms
Release time with diode in parallel (non-latching), typ. / max. 3 ms / 5 ms
Bounce time at closing contact, typ. / max. 1 ms / 5 ms
Maximum switching rate without load 50 operations/s
Ambient temperature -40 °C ... +85 °C
Thermal resistance < 150 K/W
Maximum permissible coil temperature 125 °C
Vibration resistance (function) 20 G
10 to 500 Hz
Shock resistance, half sinus, 11 ms
Shock resistance, half sinus, 0.5 ms
50 G (function)
500 G (damage)
Degree of protection / Environmental protection immersion cleanable, IP 67 / RT V
Needle ame test application time 20 s, no burning and glowing
Mounting position any
Processing information Ultrasonic cleaning is not recommended
Weight (mass) max. 0.75 g
Terminal surface NiPdAu
Moisture sensitive level (JEDEC J-STD-020B) - SMD types MSL 3
Resistance to soldering heat 260 °C / 10 s
All data refers to 23 °C unless otherwise specied.