Datasheet

108-98002 Rev. E
All specications subject to change. Consult Tyco Electronics for latest specications. 11 of 15
Telecom-, Signal and RF Relays
P2 V23079 Relay
AXICOM
Insulation
Standard Version High dielectric Version
Insulation resistance at 500 Vdc > 10
9
Ω > 10
9
Ω
Dielectric test voltage (1 min)
between coil and contacts (Relay with 1 coil)
between adjacent contact sets
between open contacts
1500 Vrms
1000 Vrms
1000 Vrms
1500 Vrms
1500 Vrms
1500 Vrms
Surge voltage resistance
according to Telcordia TR-NWT-001089 (2 /10 µs)
between coil and contacts (Relay with 1 coil)
between adjacent contact sets
between open contacts
according to (10/700 µs IEC 60950)
between coil and contacts (Relay with 1 coil)
between adjacent contact sets
between open contacts
2500 V
2500 V
2000 V
2500 V
2500 V
2000 V
2500 V
2500 V
2500 V
2500 V
2500 V
2500 V
Insulation according to IEC / EN 60950
Clearance
Creepage distance
Basic insulation
1.3 mm
2.5 mm
High Frequency Data
Capacitance
between coil and contacts
between adjacent contact sets
between open contacts
max. 2 pF
max. 1.5 pF
max. 1 pF
RF Characteristics
Isolation at 100 MHz / 900 MHz
Insertion loss at 100 MHz / 900 MHz
V.S.W.R. at 100 MHz / 900 MHz
- 39.0 dB / - 20.7 dB
- 0.02 dB / - 0.27 dB
1.04 / 1.40
General Data
Operate time at U
nom
typ. / max. 3 ms / 4 ms
Reset time (latching) at U
nom
, typ. / max. 3 ms / 4 ms
Release time without diode in parallel (non-latching), typ. / max. 2 ms / 4 ms
Release time with diode in parallel (non-latching), typ. / max. 4 ms / 6 ms
Bounce time at closing contact, typ. / max. 1 ms / 3 ms
Maximum switching rate without load 50 operations/s
Ambient temperature -40 °C ... +85 °C
Thermal resistance < 125 K/W
Maximum permissible coil temperature 125 °C
Vibration resistance (function) 35 G
10 to 1000 Hz
Shock resistance, half sinus, 11 ms 50 G (function)
150 G (damage)
Degree of protection / Environmental protection immersion cleanable, IP 67 / RT III
Needle ame test application time 20 s, no burning < 15s
Mounting position any
Processing information Ultrasonic cleaning is not recommended
Weight (mass) max. 2.8 g
Terminal surface SnCu 0.7
Moisture sensitive level (JEDEC J-STD-020B) - SMD types MSL 3
Resistance to soldering heat 265 °C / 10 s
All data refers to 23 °C unless otherwise specied.