Datasheet

108-98009 Rev. F
All specications subject to change. Consult Tyco Electronics for latest specications. 9 of 12
Telecom-, Signal and RF Relays
P1 V23026 Relay
AXICOM
Soldering conditions according IEC 60058-2-58 and
IPC/JEDEC J-STD-020B
Infrared Soldering: Temperature/Time Prole
(Lead and Housing Peak Temperature)
Infrared Soldering: Temperature/Time Prole
(Lead and Housing Peak Temperature)
Recommended Soldering Conditions
Resistance to soldering heat - Reflow profile
Recommended reflow soldering profile
Vapor Phase Soldering: Temperature/Time Prole
(Lead and Housing Peak Temperature)
240 °C
180 °C
130 °C
100 °C
20 - 40 sec
Full line: typical
Dotted line: process limits
forced
cooling
Temperature °C
Temperature °C
Time (s)
Temperature °C
Time (s)