Datasheet

06-2015, Rev. 0615
www.te.com
© 2015 Tyco Electronics Corporation,
a TE Connectivity Ltd. company
Datasheets and product specification
according to IEC 61810-1 and to be used
only together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
5
AXICOM
RF Signal Relays
HF3 Relay
(Continued)
Processing
full line: typical
dotted line: process limits
external preheating
240°C
180°C
130°C
100°C
forced cooling
20 to 40s
Time [s]
Temperature [°C]
Vapour phase soldering
temperature/time profile
(lead and housing peak temp.)
Recommended soldering conditions
Vapour phase soldering
Time [s]
Temperature [°C]
Resistance to soldering heat
Infrared soldering
temperature/time profile
(lead and housing peak temp.)
Packing
Tape and reel for SMT
Reel dimensions