Datasheet

07-2017, Rev. 0717
www.te.com
© 2017 TE Connectivity.
Datasheets and product specification ac-
cording to IEC 61810-1 and to be used only
together with the ‘Definitions’ section.
Datasheets and product data is subject to the
terms of the disclaimer and all chapters of
the ‘Definitions’ section, available at
http://relays.te.com/definitions
Datasheets, product data, ‘Definitions’ sec-
tion, application notes and all specifications
are subject to change.
2
Automotive Relays
PCB Double Relays
Double Micro Relay K (THT – THR)
(Continued)
Insulation Data
Initial dielectric strength
between open contacts 500VAC
rms
between contact and coil 500VAC
rms
Other Data
EU RoHS/ELV compliance compliant
Ambient temperature -40 to +105°C
Cold storage, IEC 60068-2-1 1000h; -40°C
Dry heat, IEC 60068-2-2 1000h; +125°C
Climatic cycling with condensation,
EN ISO 6988 20 cycles, storage 8/16 h
Temperature cycling (shock),
IEC 60068-2-14, Na 100 cycles; -40/+125°C
Temperature cycling,
IEC 60068-2-14, Nb 35 cycles; -40/+125°C
Damp heat cyclic,
IEC 60068-2-30, Db, Variant 1 6 cycles 25°C/55°C/93%RH
Damp heat constant,
IEC 60068-2-3 method Ca 56 days 40°C/95%RH
Degree of protection
THT: RT III (61810)
THR: RT II (61810)
Corrosive gas, IEC 60068-2-17: THT Qc, method 2, 1min, 70°C
IEC 60068-2-42 10 days
IEC 60068-2-43 10 days
Vibration resistance (functional)
IEC 60068-2-6 (sine sweep) 10 to 500Hz; 6g
5)
Shock resistance (functional)
IEC 60068-2-27 (half sine) 6ms, up to 30g
5)
Terminal type PCB:THT, THR
Weight approx. 8g (0.28oz)
Solderability (aging 3: 4h/155°C) THT,
IEC 60068-2-20 Ta, method 1, hot dip 5s, 215°C
Resistance to soldering heat THT,
IEC 60068-2-20 Tb, method 1A, hot dip 10s, 260°C,
with thermal screen
Resistance to soldering heat THR,
IEC 60068-2-58 260°C; preheating min 130°C
Storage conditions according IEC 60068-1
6)
Packaging unit 990 pcs.
5) Depending on mounting position: no change in the switching state >10μs.
6) For general storage and processing recommendations please refer to our Application
Notes and especially to Storage in the Definitions or at http://relays.te.com/appnotes/
2 form C, 2 CO
Remark:
Positional tolerances according to DIN EN ISO 5458
Terminal Assignment
Bottom view on solder pins
Dimensions
Double Micro Relay THT
View of the Terminals
Bottom view on solder pins
11
12
15
13
14
24
25
23
22
21
86dtw_ab
86dtw_se
23,6
±0,2
2,5
±0,2
0,6
±0,2
6,2
±0,1
7,65
±0,2
9,9
±0,2
2,8
*)
±0,2
12,9
*) Additional tin tops
max. 1 mm
±0,3
0,4
±0,1
0,95
±0,2
A
3
3,6
12,67
8,5
6,66
0,5
11,67
10x
0,5 AC
0,4 A
19,67
7,5
10,2
10,26
11
15
12
24
13
1,72
0,5 4x
+0,05 0
6x1,2
+0,05
0
20,17
B
10x
0,5 AB
0,4 A
7,26
C
22
25
23
14
21
0,97
0,15
4,5
0,25
0,97
0,15
11
15
12
24
13
4x
1
0,15
3,4
0,25
3,7
0,25
22
25
23
14
21
0,48
0,15
5,87
0,15
4,5
0,25
3,4
0,25
0,97
0,15
0,97
0,15
3,7
0,25
5,87
0,15
0,48
0,15
2,1
0,25
2,1
0,25
1,4
0,25
1,4
0,25
1,37
0,06