Service manual

STP 11-25R13-SM-TG
A - 11
A-14. Clean Excess Solder.
Clean excess solder from the board before replacing the component.
a. Place the lead of the component into the holes on the board.
b. Bend leads under the board to make contact with the etching run.
c. Place a clamp on the end of the component being soldered.
d. Apply the soldering iron and solder to the lead on the board until the solder adheres to the lead
and the board, usually a three-count heat.
e. Clean excess solder from board.
A-15. Test Operate.