Service manual

STP 11-25R13-SM-TG
A - 4
(3) Thermal shunts (Figure A-5), commonly called heat sinks, are used to protect heat-sensitive
devices and components by dissipating the heat from the soldering iron or gun. The heat sink, usually a
clip-on device, is placed on the lead to be soldered between the solder connection and the component.
Figure A-5. Thermal Shunts
(4) Anti-wicking tweezers (Figure A-6) are a type of thermal shunt used during the tinning process
to prevent solder from running up under the insulation of the wire being tinned.
Figure A-6. Anti-Wicking Tweezer
(5) Wire-bending tools (Figure A-7) have a smooth bending surface to prevent damage to
component leads from nicks and cuts. These tools are used to bend heavy gauge wire and component
leads.
Figure A-7. Wire-Bending Tool