Datasheet

TLV320AIC3107
SLOS545D –NOVEMBER 2008 –REVISED DECEMBER 2014 www.ti.com
12 Power Supply Recommendations
The TLV320AIC3107 has been designed to be extremely tolerant of power supply sequencing. However, in
some rare instances, unexpected conditions can be attributed to power supply sequencing. The following
sequence will provide the most robust operation.
IOVDD should be powered up first. The analog supplies, which include AVDD and DRVDD, should be powered
up second. The digital supply DVDD should be powered up last. Keep RESET low until all supplies are stable.
The analog supplies should be greater than or equal to DVDD at all times.
Figure 40. TLV320AIC3107 Power Supply Sequencing
SYMBOL PARAMETER MIN MAX UNIT
t1 IOVDD to AVDD, DRVDD 0
t2 AVDD to DVDD 0 4 ms
t3 IOVDD to DVDD 0
13 Layout
13.1 Layout Guidelines
PCB design is made considering the application, and the review is specific for each system requirements.
However, general considerations can optimize the system performance.
• The TLV320AIC3107IRSB thermal pad should be connected to analog output driver ground using multiple
VIAS to minimize impedance between the device and ground.
• SPVSS balls of TLV320AIC3107IYZF are recommended to be soldered directly to Class-D ground.
• SPVSS balls of TLV320AIC3107IYZF are recommended to be soldered directly to Class-D ground.
• The TLV320AIC3107 requires the decoupling capacitors to be placed as close as possible to the device
power supply terminals.
• If possible, route the differential audio signals differentially on the PCB. This is recommended to get better
noise immunity.
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