Datasheet

TLV320AIC3107
www.ti.com SLOS545D –NOVEMBER 2008–REVISED DECEMBER 2014
8.4 Thermal Information
TLV320AIC3107
THERMAL METRIC
(1)
RSB YZF UNIT
40 PINS 42 PINS
R
θJA
Junction-to-ambient thermal resistance 30.7 49.5
R
θJC(top)
Junction-to-case (top) thermal resistance 16 0.1
R
θJB
Junction-to-board thermal resistance 4.6 7.1
°C/W
ψ
JT
Junction-to-top characterization parameter 0.2 0.8
ψ
JB
Junction-to-board characterization parameter 4.5 7
R
θJC(bot)
Junction-to-case (bottom) thermal resistance 0.9 n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
8.5 Dissipation Ratings
(1)
T
A
= 25°C DERATING T
A
= 75°C T
A
= 85°C
PACKAGE TYPE
POWER RATING FACTOR POWER RATING POWER RATING
DSBGA
(2)
1.60 W 20 mW/°C 600 mW 400 mW
QFN 2.35 W 29.4 mW/° C 882 mW 588 mW
(1) This data was taken using 2 oz. trace and copper pad that is soldered directly to a JEDEC standard 4-layer 3 in × 3 in PCB.
(2) Product Preview
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