Datasheet
Table Of Contents
- Features
- 1. Ordering Information
- 2. Typical Applications
- 3. Pinout and Block Diagram
- 4. Overview
- 5. Resources
- 6. Capacitive Touch Sensing
- 7. CPU
- 8. Memories
- 9. EDMA – Enhanced DMA Controller
- 10. Event System
- 11. System Clock and Clock options
- 11.1 Features
- 11.2 Overview
- 11.3 Clock Sources
- 11.3.1 32kHz Ultra Low Power Internal Oscillator
- 11.3.2 32.768kHz Calibrated Internal Oscillator
- 11.3.3 32.768kHz Crystal Oscillator
- 11.3.4 0.4 - 16MHz Crystal Oscillator
- 11.3.5 8MHz Calibrated Internal Oscillator
- 11.3.6 32MHz Run-time Calibrated Internal Oscillator
- 11.3.7 External Clock Sources
- 11.3.8 PLL with 1x-31x Multiplication Factor
- 12. Power Management and Sleep Modes
- 13. System Control and Reset
- 14. WDT – Watchdog Timer
- 15. Interrupts and Programmable Multilevel Interrupt Controller
- 16. I/O Ports
- 17. Timer Counter Type 4 and 5
- 18. WeX – Waveform Extension
- 19. Hi-Res – High Resolution Extension
- 20. Fault Extension
- 21. RTC – 16-bit Real-Time Counter
- 22. TWI – Two-Wire Interface
- 23. SPI – Serial Peripheral Interface
- 24. USART
- 25. IRCOM – IR Communication Module
- 26. XCL – XMEGA Custom Logic Module
- 27. CRC – Cyclic Redundancy Check Generator
- 28. ADC – 12-bit Analog to Digital Converter
- 29. DAC – Digital to Analog Converter
- 30. AC – Analog Comparator
- 31. Programming and Debugging
- 32. Pinout and Pin Functions
- 33. Peripheral Module Address Map
- 34. Instruction Set Summary
- 35. Packaging Information
- 36. Electrical Characteristics
- 36.1 Absolute Maximum Ratings
- 36.2 General Operating Ratings
- 36.3 Current Consumption
- 36.4 Wake-up Time from Sleep Modes
- 36.5 I/O Pin Characteristics
- 36.6 ADC Characteristics
- 36.7 DAC Characteristics
- 36.8 Analog Comparator Characteristics
- 36.9 Bandgap and Internal 1.0V Reference Characteristics
- 36.10 External Reset Characteristics
- 36.11 Power-on Reset Characteristics
- 36.12 Flash and EEPROM Characteristics
- 36.13 Clock and Oscillator Characteristics
- 36.13.1 Calibrated 32.768kHz Internal Oscillator Characteristics
- 36.13.2 Calibrated 8MHz Internal Oscillator Characteristics
- 36.13.3 Calibrated and Tunable 32MHz Internal Oscillator Characteristics
- 36.13.4 32 kHz Internal ULP Oscillator Characteristics
- 36.13.5 Internal Phase Locked Loop (PLL) Characteristics
- 36.13.6 External Clock Characteristics
- 36.13.7 External 16MHz Crystal Oscillator and XOSC Characteristics
- 36.13.8 External 32.768kHz Crystal Oscillator and TOSC Characteristics
- 36.14 SPI Characteristics
- 36.15 Two-Wire Interface Characteristics
- 37. Typical Characteristics
- 37.1 Current Consumption
- 37.2 I/O Pin Characteristics
- 37.3 ADC Characteristics
- 37.4 DAC Characteristics
- 37.5 AC Characteristics
- 37.6 Internal 1.0V Reference Characteristics
- 37.7 BOD Characteristics
- 37.8 External Reset Characteristics
- 37.9 Power-on Reset Characteristics
- 37.10 Oscillator Characteristics
- 37.11 Two-wire Interface Characteristics
- 37.12 PDI Characteristics
- 38. Errata – ATxmega32E5 / ATxmega16E5 / ATxmega8E5
- 39. Revision History
- Table of Contents

11
XMEGA E5 [DATASHEET]
Atmel-8153J–AVR-ATxmega8E5-ATxmega16E5-ATxmega32E5_Datasheet–11/2014
8. Memories
8.1 Features
Flash program memory
One linear address space
In-system programmable
Self-programming and boot loader support
Application section for application code
Application table section for application code or data storage
Boot section for application code or bootloader code
Separate read/write protection lock bits for all sections
Built in fast CRC check of a selectable flash program memory section
Data memory
One linear address space
Single-cycle access from CPU
SRAM
EEPROM
Byte and page accessible
Memory mapped for direct load and store
I/O memory
Configuration and status registers for all peripherals and modules
Four bit-accessible general purpose registers for global variables or flags
Bus arbitration
Deterministic handling of priority between CPU, EDMA controller, and other bus masters
Separate buses for SRAM, EEPROM, and I/O memory
Simultaneous bus access for CPU and EDMA controller
Production signature row memory for factory programmed data
ID for each microcontroller device type
Serial number for each device
Calibration bytes for factory calibrated peripherals
User signature row
One flash page in size
Can be read and written from software
Content is kept after chip erase
8.2 Overview
The Atmel AVR architecture has two main memory spaces, the program memory and the data memory. Executable code
can reside only in the program memory, while data can be stored in the program memory and the data memory. The data
memory includes the internal SRAM, and EEPROM for nonvolatile data storage. All memory spaces are linear and
require no memory bank switching. Nonvolatile memory (NVM) spaces can be locked for further write and read/write
operations. This prevents unrestricted access to the application software.
A separate memory section contains the fuse bytes. These are used for configuring important system functions, and can
only be written by an external programmer.
The available memory size configurations are shown in “Ordering Information” on page 2”. In addition, each device has a
Flash memory signature row for calibration data, device identification, serial number etc.
8.3 Flash Program Memory
The Atmel AVR XMEGA devices contain on-chip, in-system reprogrammable flash memory for program storage. The
flash memory can be accessed for read and write from an external programmer through the PDI or from application
software running in the device.