Datasheet
98
T89C51AC2
4127D–8051–02/03
Electrical Characteristics
Absolute Maximum Ratings*
DC Parameters for Standard Voltage
TA = -40°C to +85°C; V
SS
= 0V; V
CC
= 3V to 5.5V; F = 0 to 40 MHz
Ambiant Temperature Under Bias:
I = industrial ....................................................... -40°C to 85°C
Storage Temperature .................................... -65°C to + 150°C
Voltage on V
CC
from V
SS
......................................-0.5V to + 6V
Voltage on Any Pin from V
SS
..................... -0.5V to V
CC
+ 0.2V
Power Dissipation ............................................................... 1W
Table 70. DC Parameters in Standard Voltage
Symbol Parameter Min Typ
(5)
Max Unit Test Conditions
V
IL
Input Low Voltage -0.5 0.2Vcc - 0.1 V
V
IH
Input High Voltage except XTAL1, RST 0.2 V
CC
+ 0.9 V
CC
+ 0.5 V
V
IH1
Input High Voltage, XTAL1, RST 0.7 V
CC
V
CC
+ 0.5 V
V
OL
Output Low Voltage, ports 1, 2, 3 and 4
(6)
0.3
0.45
1.0
V
V
V
I
OL
= 100 µA
(4)
I
OL
= 1.6 mA
(4)
I
OL
= 3.5 mA
(4)
V
OL1
Output Low Voltage, port 0, ALE, PSEN
(6)
0.3
0.45
1.0
V
V
V
I
OL
= 200 µA
(4)
I
OL
= 3.2 mA
(4)
I
OL
= 7.0 mA
(4)
V
OH
Output High Voltage, ports 1, 2, 3, 4 and 5
V
CC
- 0.3
V
CC
- 0.7
V
CC
- 1.5
V
V
V
I
OH
= -10 µA
I
OH
= -30 µA
I
OH
= -60 µA
V
OH1
Output High Voltage, port 0, ALE, PSEN
V
CC
- 0.3
V
CC
- 0.7
V
CC
- 1.5
V
V
V
I
OH
= -200 µA
I
OH
= -3.2 mA
I
OH
= -7.0 mA
R
RST
RST Pulldown Resistor 20 40 200 kΩ
I
IL
Logical 0 Input Current ports 1, 2, 3 and 4 -50 µA Vin = 0.45V
I
LI
Input Leakage Current ±10 µA 0.45V < Vin < V
CC
I
TL
Logical 1 to 0 Transition Current, ports 1, 2, 3
and 4
-650 µA Vin = 2.0V
C
IO
Capacitance of I/O Buffer 10 pF
Fc = 1 MHz
T
A = 25°C
I
PD
Power-down Current 160 350 µA3V < V
CC
< 5.5V
(3)
I
CC
Power Supply Current
I
CCOP
= 0.7 Freq (MHz) + 3 mA
ICC_FLASH_WRITE
(7)
=0.4 Freq (MHz) + 20 mA
I
CCIDLE
= 0.6 Freq (MHz) + 2 mA
3V < V
CC
< 5.5V
(1)(2)
*NOTICE: Stresses at or above those listed under “Absolute Max-
imum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional oper-
ation of the device at these or any other conditions
above those indicated in the operational sections of
this specification is not implied. Exposure to absolute
maximum rating conditions may affect device reliability.
The power dissipation is based on the maximum allow-
able die temperature and the thermal resistance of the
package.