Datasheet

53
AT30TSE752A/754A/758A [DATASHEET]
Atmel-8854G-DTS-AT30TSE752A-754A-758A-Datasheet_102014
15.2 8XM — 8-lead MSOP
TITLE
DRAWING NO. GPC
REV.
Package Drawing Contact:
[e-mail]
8XMTZD A
8XM, 8-lead, 3.0x3.0mm Body, Plastic Thin
Shrink Small Outline Package (TSSOP/MSOP)
3/1/11
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
NOTE
A - - 1.10
A
1 0.05 0.10 0.15
A
2 0.75 0.85 0.95
b 0.22 - 0.38
D 2.90 3.00 3.10 1
E 4.90 BSC
E
1 2.90 3.00 3.10 1
e 0.65 BSC
L 0.40 0.55 0.80 2
A
e
O
C
C
A
1
N
Pin 1
E
1
1
A
2
3
SIDE VIEW
END VIEW
DETAIL 'A'
TOP VIEW
SEATING
PLANE
123
SEE
DETAIL "A"
2
L
4
1.
ONE ANOTHER WITHIN 0.10mm AT SEATING PLANE.
4.
3.
2.
FORMED LEADS SHALL BE PLANAR WITH RESPECT TO
TERMINAL POSITIONS ARE SHOWN FOR REFERENCE ONLY.
FOR SOLDERING TO A SUBSTRATE.
DIMENSION IS THE LENGTH OF TERMINAL
PROTRUSIONS SHALL NOT EXCEED 0.15mm PER SIDE.
AT DATUM PLANE -H- , MOLD FLASH OR
FLASH OR PROTRUSIONS, AND ARE MEASURED
DIMENSIONS "D" & "E1" DO NOT INCLUDE MOLD
NOTES:
C0.10
C
L
BSC
0.25
D
C
0.20 B A
2X
(N/2 TIPS)
E
1
0.07 R. MIN
2 PLACES
-C-
SEATING PLANE
-H-
-A-
-B-
S0.05
5. DATUMS -A- AND -B- TO BE DETERMINED BY DATUM
PLANE -H- .
BOTTOM VIEW
N
321
8°
0°
C
C
O
4°
b