User guide

Glossary - 2
flip chip: A die with solder bumps
which is placed die circuit side-down
on a PCB.
flip chip underfill: Dispensing lines
of fluid around the perimeter of a flip-
chip so that the fluid flows underneath
the chip.
flow rate: The amount of fluid in
milligrams per second that is flowing
from the valve.
gantry: A non-conveyorized
dispensing area on a non-conveyorized
dispensing system.
heaters: Either contact or infrared
modules located between the conveyor
rails or inside of the tooling plate (in the
pre-dispense, dispense and post
dispense areas of the dispensing
system). Used to heat parts during
dispensing and control the cure of the
epoxy.
height sensor: An instrument used
to locate the surface of the substrate to
determine its height and record the
information so the dispense tip can be
positioned at an exact distance above
the surface, ensuring consistent
dispensing.
home: The dispense head location
whose (X,Y,Z) location is defined as
(0,0,0). The default setting is where the
dispense head was located when the
system was first turned on.
icons: Small symbolic buttons used to
execute a menu shortcut.
I/O (Input/Output): Communication
between one component or device and
another.
JIT program: A Just-In-Time fluid
delivery schedule based on fluid shelf-
life. The schedule is worked out with
the distributor to prevent over-stocking
so fluid shelf-life does not expire
before it is used.
kPa: Air pressure measured in kilos
per square one thousand Pascals.
lead frame: A type of part handler
where multiple parts are imbedded in a
metal tape.
LED light: Light-Emitting-Diode.
The needle sensor has an LED
indicator light.
LLHC: Lower left hand corner.
load cell: A sensor located on Model
NSZ needle sensors that is used as a
touch point for substrate height
measurements. The needle sensor
probe touches down on the load cell
which records the value (Automatic
Height Sensor Calibration).
LRHC: Lower right hand corner.
Material Safety Data Sheet
(MSDS): Information for the safe
use of materials. Generally included in
the fluid packaging.
message areas: In a Windows
program, these are areas or boxes that
contain information for the operator.
micro pots: Dispensing technique for
filling divots or voids on the substrate
or part.
mil: One thousandths on an inch, or 1
x 10
-3
inches.
model window: An area defined
during the fiducial location process.
The model window encompasses the
fiducial.