User's Manual

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Table Of Contents

1 Introduction
- 1.1 Key features
NOTE:
NOTE:
- 1.2 Jefferson Peak module SKUs
2 Product Architecture
- 2.1 Integrated Connectivity concept
- 2.2 Jefferson Peak interfaces
3 Electrical Specifications
- 3.1 2230 and 1216 form factor pinouts
- 3.2 Input/output electrical specifications
- 3.3 Peak current consumption
- 3.4 M.2 power and ripple limits
  - 3.4.1 Power supply ripples
  - 3.4.2 Platform state transitions
- 3.5 M.2 ground (GND)
4 Mechanical Specifications
- 4.1 Weight
- 4.2 M.2 2230 mechanical specification
- 4.3 M.2 1216 mechanical specification
- 4.4 Z height
- 4.5 M.2 antenna retention
  - 4.5.1 Recommended method for retention of M.2 cable
5 Performance
- 5.1 Power consumption
  - 5.1.1 Wi-Fi power consumption
1. BT in SW RF-KILL in all the tests
2. HB values refer to internal FE SKU
3. OS: Win10
- 5.1.2 BT power consumption
1. Wi-Fi in SW RF-KILL in all the tests
2. OS: Win10
3. WsP is Master device
- 5.2 Wi-Fi performance
  - 5.2.1 Wi-Fi Tx power (TBD)
1. The TX power per MCS relate to IEEE, mask compliance and limited by regulatory TX power limits.
2. The values relate to internal FE SKU
3. The values are for typical device and typical conditions
- 5.2.2 Wi-Fi sensitivity
1. Measured at ANT port
2. Typical means Nominal corner, AVG over non BE CHs. AVG over freq segment and chains
3. Max means over PVT
- 5.2.3 Wi-Fi throughput targets
NOTE: The throughput values relate to Intel® Skylake Platform and CPU, Single User.
- 5.3 Bluetooth performance
6 Thermal Specifications
- 6.1 Thermal dissipation
- 6.2 Thermal specifications
- 6.3 Thermal management
- 6.4 Module placement recommendations
- 6.5 Nonoperational module thermal storage
7 Regulatory
- 7.1 Regulatory channel support and output power
- 7.2 Wi-Fi channel configuration
- 7.3 Regulatory and safety certification
8 Dynamic Regulatory Solution
- 8.1 Overview
9 Platform Design Guidelines
- 9.1 Socket 1 key options for 2230 cards

Thermal Specifications

Intel

Wireless-AC 9560 (Jefferson Peak)

April 2017 External Product Specification (EPS)

Document Number: 567240–1.0 Intel Confidential 41

6.4 Module placement recommendations

The module disperses excess heat through the RF shield and the screws that ground the module to the

chassis.

Correct module placement will ensure optimal thermal performance:

 The 2230 module orientation should be shield up.

 The 2230 module connection to chassis should be with a single metal screw.

6.5 Nonoperational module thermal storage

Table 6–3 Storage conditions

Environment Limits

Storage Temperature (Non–Operational)

–40 ºC to 70 ºC

Humidity (Non–Operational) 50% to 90% non–condensing (at temperatures of

25 ºC to 35 ºC)