User's Manual
Table Of Contents
- 1 Introduction
- NOTE:
- NOTE:
- 2 Product Architecture
- 3 Electrical Specifications
- 4 Mechanical Specifications
- 5 Performance
- 1. BT in SW RF-KILL in all the tests
- 2. HB values refer to internal FE SKU
- 3. OS: Win10
- 1. Wi-Fi in SW RF-KILL in all the tests
- 2. OS: Win10
- 3. WsP is Master device
- 1. The TX power per MCS relate to IEEE, mask compliance and limited by regulatory TX power limits.
- 2. The values relate to internal FE SKU
- 3. The values are for typical device and typical conditions
- 1. Measured at ANT port
- 2. Typical means Nominal corner, AVG over non BE CHs. AVG over freq segment and chains
- 3. Max means over PVT
- NOTE: The throughput values relate to Intel® Skylake Platform and CPU, Single User.
- 6 Thermal Specifications
- 7 Regulatory
- 8 Dynamic Regulatory Solution
- 9 Platform Design Guidelines
- 9.1 Socket 1 key options for 2230 cards
- 9.1.1 Socket 1 Hybrid Key E scheme
- 9.1.2 Connectorized Hybrid Key E (2230) pin-out
- 9.1.3 Special considerations for the Hybrid Key E scheme
- 9.1.4 Soldered-down (1216) pin-out
- 9.1.5 Breakout example for JfP soldered-down module
- 9.1.6 Signal connection pitfalls
- 9.1.7 Pullups and pulldowns
- 9.1.8 IO connection scenarios and best practices
- 9.1.9 I/F specific guidelines
- 9.1.10 Connectivity module power control
- 9.1.11 Power supply de-coupling
- 9.1.12 Wi-Fi wireless disable and HW RF-KILL
- 9.1.13 M.2 Bluetooth HW RF-KILL
- 9.1.14 BIOS
- 9.1 Socket 1 key options for 2230 cards
Thermal Specifications
Intel
®
Wireless-AC 9560 (Jefferson Peak)
External Product Specification (EPS) April 2017
40 Intel Confidential Document Number: 567240–1.0
6 Thermal Specifications
Note: The numbers in this section are not final, and are subject to change.
6.1 Thermal dissipation
Maximum thermal dissipation is based on the assumption that both Wi-Fi and Bluetooth
communication are active. Table 6–1 describes the thermal dissipation and targets per operated
mode.
Table 6–1 Thermal dissipation
Use Case PC (mW)
Wi-Fi BT Wi-Fi BT
Worst case TDP: Based on average power
consumption measurement over five
minutes with max TCP/IP throughput
activity
NA NA
Note: Not applicable for scenarios that may only be exercised using lab or OEM support software
tools.
6.2 Thermal specifications
Table 6–2 Thermal management
Name Description
Thermal shield performance targets Full performance at shield temperatures up to 80 ºC.
Testing conditions:
System environmental conditions:
High limit: ~50 ºC (TBD) under controlled environment (oven),
with no air flow (inside a box).
Low limit: 0 ºC (starting point) under controlled environment
(oven), with no air flow (inside a box).
Thermal Silicon protection (CT–Kill) Thermal silicon protection will not be activated below 85 ºC (TBD) T–
shield temperature.
6.3 Thermal management
The device thermal management cuts off RF operation once a maximum temperature threshold
(Critical Temperature termination, CT–Kill) has been exceeded. After the cutoff point is reached, the
RF remains at the off state until it cools down to the thermal activation threshold. During this time the
host cannot set the RF back to on.
When the product is heating up and nearing CT Kill, it will start decreasing the Wi-Fi activity in order
to prevent the unit from heating further and reaching critical temperature. In such case, connectivity
will be maintained but performance might be degraded gradually.