User's Manual
Table Of Contents
- 1 Introduction
- NOTE:
- NOTE:
- 2 Product Architecture
- 3 Electrical Specifications
- 4 Mechanical Specifications
- 5 Performance
- 1. BT in SW RF-KILL in all the tests
- 2. HB values refer to internal FE SKU
- 3. OS: Win10
- 1. Wi-Fi in SW RF-KILL in all the tests
- 2. OS: Win10
- 3. WsP is Master device
- 1. The TX power per MCS relate to IEEE, mask compliance and limited by regulatory TX power limits.
- 2. The values relate to internal FE SKU
- 3. The values are for typical device and typical conditions
- 1. Measured at ANT port
- 2. Typical means Nominal corner, AVG over non BE CHs. AVG over freq segment and chains
- 3. Max means over PVT
- NOTE: The throughput values relate to Intel® Skylake Platform and CPU, Single User.
- 6 Thermal Specifications
- 7 Regulatory
- 8 Dynamic Regulatory Solution
- 9 Platform Design Guidelines
- 9.1 Socket 1 key options for 2230 cards
- 9.1.1 Socket 1 Hybrid Key E scheme
- 9.1.2 Connectorized Hybrid Key E (2230) pin-out
- 9.1.3 Special considerations for the Hybrid Key E scheme
- 9.1.4 Soldered-down (1216) pin-out
- 9.1.5 Breakout example for JfP soldered-down module
- 9.1.6 Signal connection pitfalls
- 9.1.7 Pullups and pulldowns
- 9.1.8 IO connection scenarios and best practices
- 9.1.9 I/F specific guidelines
- 9.1.10 Connectivity module power control
- 9.1.11 Power supply de-coupling
- 9.1.12 Wi-Fi wireless disable and HW RF-KILL
- 9.1.13 M.2 Bluetooth HW RF-KILL
- 9.1.14 BIOS
- 9.1 Socket 1 key options for 2230 cards
Performance
Intel
®
Wireless-AC 9560 (Jefferson Peak)
External Product Specification (EPS) April 2017
38 Intel Confidential Document Number: 567240–1.0
5.3 Bluetooth performance
5.3.1 Bluetooth Tx power (TBD)
Note: The content in this section is to be determined (TBD) in the next release.
Table 5–6 Bluetooth Tx power (TBD)
WsP BT Tx power Tx Power 2230 MS
(dBm, acc: +/–2 dB)
Tx Power 1216
(dBm, acc: +/–2 dB)
Notes
BR
Typical Conditions
EDR2
Typical Conditions
EDR3
Typical Conditions
BLE
Typical Conditions
Typical Operating Conditions are defined as:
1. Temperature of 25°C and nominal supply voltage.
2. The measured material is of typical process only.
3. The reported figure is the average power level over the frequency band.
4. For all measurements, the specified temperature is measured at the shield.
5. The power levels are specified at the product antenna port.
6. Accuracy is +/-2dB.
5.3.2 Bluetooth sensitivity (TBD)
Note: The content in this section is to be determined (TBD) in the next release.
Table 5–7 Bluetooth sensitivity (TBD)
WsP BT Tx power Tx Power 2230 MS
(dBm, acc: +/–1.5 dB)
Tx Power 1216
(dBm, acc: +/–1.5 dB)
Notes
BR
Typical Conditions
EDR2
Typical Conditions
EDR3
Typical Conditions
BLE
Typical Conditions
Typical Operating Conditions are defined as:
1. Nominal BQB test conditions. In addition the following definitions apply:
2. Temperature of 25°C and nominal supply voltage
3. The measured material is of typical process only
4. The measurements are performed at spectrally clean (i.e., non-spur) channels
5. For all measurements, the specified temperature is measured at the shield.
6. The sensitivity is specified at the product antenna port.
7. Assuming all co-located cores are disabled.
8. Averaged value across frequency