User's Manual
Table Of Contents
- 1 Introduction
- NOTE:
- NOTE:
- 2 Product Architecture
- 3 Electrical Specifications
- 4 Mechanical Specifications
- 5 Performance
- 1. BT in SW RF-KILL in all the tests
- 2. HB values refer to internal FE SKU
- 3. OS: Win10
- 1. Wi-Fi in SW RF-KILL in all the tests
- 2. OS: Win10
- 3. WsP is Master device
- 1. The TX power per MCS relate to IEEE, mask compliance and limited by regulatory TX power limits.
- 2. The values relate to internal FE SKU
- 3. The values are for typical device and typical conditions
- 1. Measured at ANT port
- 2. Typical means Nominal corner, AVG over non BE CHs. AVG over freq segment and chains
- 3. Max means over PVT
- NOTE: The throughput values relate to Intel® Skylake Platform and CPU, Single User.
- 6 Thermal Specifications
- 7 Regulatory
- 8 Dynamic Regulatory Solution
- 9 Platform Design Guidelines
- 9.1 Socket 1 key options for 2230 cards
- 9.1.1 Socket 1 Hybrid Key E scheme
- 9.1.2 Connectorized Hybrid Key E (2230) pin-out
- 9.1.3 Special considerations for the Hybrid Key E scheme
- 9.1.4 Soldered-down (1216) pin-out
- 9.1.5 Breakout example for JfP soldered-down module
- 9.1.6 Signal connection pitfalls
- 9.1.7 Pullups and pulldowns
- 9.1.8 IO connection scenarios and best practices
- 9.1.9 I/F specific guidelines
- 9.1.10 Connectivity module power control
- 9.1.11 Power supply de-coupling
- 9.1.12 Wi-Fi wireless disable and HW RF-KILL
- 9.1.13 M.2 Bluetooth HW RF-KILL
- 9.1.14 BIOS
- 9.1 Socket 1 key options for 2230 cards
Electrical Specifications
Intel
®
Wireless-AC 9560 (Jefferson Peak)
April 2017 External Product Specification (EPS)
Document Number: 567240–1.0 Intel Confidential 23
I/O type
Symbol Parameter Min Max Unit Notes
V
OL
Open
Drain
Output Low Voltage 0 0.36 Io = 2mA
Load = 64pF
RPU = 1Kohm
C
IO
IO Pin Capacitance
2
pF
1.8V FS_CR
CLKREQ0
(Note 2)
V
IH
Input High Voltage
1.26
2.1
V
V
IL
Input Low Voltage
-0.3
0.54
V
R
PU/PD
Weak Pull-Up or Pull-
Down
100 180 Kohm
I
IN
Input Leakage Current
10
uA
No Pulls
V
OH
Output High Voltage 1.62 1.8 V Io = 2mA
Load = 20pF
V
OL
Output Low Voltage 0 0.18 Io = 2mA
Load = 20pF
T
R
, T
F
Rise, Fall Time
18.5
ns
Load = 20pF
C
IO
IO Pin Capacitance
2
pF
1.8V FS_3VT
C_P32K
(Note 3)
V
IH
Input High Voltage
1.26
2.1
V
V
IL
Input Low Voltage
-0.3
0.54
V
R
PU/PD
Weak Pull-Up or Pull-
Down
150 (typical) Kohm
I
IN
Input Leakage Current
10
uA
No Pulls
V
OH
Output High Voltage 1.62 1.8 V Io = 1mA
Load = 30pF
V
OL
Output Low Voltage 0 0.18 Io = 1mA
Load = 30pF
T
R
, T
F
Rise, Fall Time
20
ns
Load = 30pF
C
IO
IO Pin Capacitance
2
pF
BRI and RGI 1.8V I/O
BRI_DT
BRI_RSP
RGI_DT
RGI_RSP
(Note 4)
V
IH
Input High Voltage
1.26
TBD
V
V
IL
Input Low Voltage
TBD
0.54
V
R
PU/PD
I
IN
V
OH
Output High Voltage
1.62
1.8
V
50ohm driver
impedance
Load = 35pF
V
OL
Output Low Voltage
0
0.18
T
R
, T
F
Rise, Fall Time
1.5
4.5
ns
R
b
Baud rate
4.8
76.8
Mbaud
Tolerance +/-5%
C
IO
IO Pin Capacitance
2
pF
CNVio
(Note 5)
Signal parameters follow the MIPI D-PHY Specifications Rev1.1