User Manual
Table Of Contents
- About this manual
- Chapter 1: Getting to know your Embedded Computer
- Chapter 2: Using your Embedded Computer
- Chapter 3: Upgrading your Embedded Computer
- 3.1 Removing the bottom cover
- 3.2 Replacing the bottom cover
- 3.3 Installing memory modules
- 3.4 Installing 2.5” storage device
- 3.5 Installing an M.2 SSD
- 3.6 Installing a nano SIM card
- 3.7 Installing an SD card
- 3.8 Installing a wireless card to the M.2 slot
- 3.9 Installing an mPCIe / mSATA module
- 3.10 Installing antennas (optional)
- 3.11 Installing the USB 2.0 module (on selected models)
- 3.12 Installing the Serial port module (on selected models)
- 3.13 Installing the PoE LAN module (on selected models)
- 3.14 Installing the VESA mount (optional)
- 3.15 Installing the wall mount
- 3.16 Installing DIN rail clips (optional)
- Chapter 4: BIOS Setup
- 4.1 Getting to know your BIOS
- 4.2 BIOS setup program
- 4.3 Main Menu
- 4.4 Advanced menu
- 4.4.1 Trusted Computing
- 4.4.2 PCH Storage Configuration
- 4.4.3 Onboard Devices Configuration
- 4.4.4 ACPI Settings
- 4.4.5 APM Configuration
- 4.4.6 SMART Settings
- 4.4.7 NCT6116D Super IO Configuration
- 4.4.8 NCT6116D HW Monitor
- 4.4.9 Serial Port Console Redirection
- 4.4.10 CPU Configuration
- 4.4.11 AMI Graphic Output Protocol Policy
- 4.4.12 PCI Subsystem Settings
- 4.4.13 USB Configuration
- 4.4.14 Network Stack Configuration
- 4.4.15 SDIO Configuration
- 4.4.16 Platform Trust Technology
- 4.4.17 Security Configuration
- 4.4.18 Thermal
- 4.5 Security
- 4.6 Boot menu
- 4.7 Save & Exit menu
- 4.8 Updating your BIOS
- Chapter 5: Watchdog Timer
- Appendix
128
PE Series
「產品之限用物質含有情況」之相關資訊,請參考下表:
Taiwan Declaration of Restricted Substances Marking
甲類警語
警告使用者:此為甲類資訊技術設備,於居住環境中使用時,可能會造
成射頻擾動,在此種情況下,使用者會被要求採取某些適當的對策。
Taiwan BSMI Class A Notice
This product is Class A. In a domestic environment, this product may cause
radio interference. You may be required to take adequate measures.
單元
(Unit)
限用物質及其化學符號
(Restricted substances and its chemical symbols)
鉛
Lead
(Pb)
汞
Mercury
(Hg)
鎘
Cadium
(Cd)
六價鉻
Hexavalent
chromium
(Cr
+6
)
多溴聯苯
Polybrominated
biphenyls
(PBB)
多溴二苯醚
Polybrominated
diphenyls ethers
(PBDE)
印刷電路板
及電子組件
PCB
- ○ ○ ○ ○ ○
外殼
Chassis
- ○ ○ ○ ○ ○
硬碟
Disk drive
- ○ ○ ○ ○ ○
散熱設備
Thermal
solutions
- ○ ○ ○ ○ ○
其他及其
配件
(線材等)
Accessories (e.g.,
cables)
- ○ ○ ○ ○ ○
備考 1.“ ○”係指該項限用物質之百分比含量未超出百分比含量基準值。
備考 2.“-”係指該項限用物質為排除項目。
Note 1 “○“ indicates that the percentage content of the restricted substance does not exceed the
percentage of reference value of presence.
Note 2 The “-“ indicates that the restricted substance corresponds to the exemption.