User's Manual

System Design Considerations
6-8 Intel
®
820 Chipset Design Guide
6.4 Glue Chip 3 (Intel
®
820 Chipset Glue Chip)
To reduce the component count and BOM cost of the Intel
®
820 chipset platform, Intel has
developed an ASIC component that integrates miscellaneous platform logic into a single chip. The
Glue Chip 3 is designed to integrate some or all of the following functions into a single device. By
integrating much of the required glue logic into a single device, overall board cost can be reduced.
Features
•
PWROK signal generation
•
Control circuitry for Suspend To RAM
•
Power Supply power up circuitry
•
RSMRST# generation
•
Backfeed cutoff circuit for suspend to RAM
•
5V reference generation
•
Flash FLUSH# / INIT# circuit
•
HD single color LED driver
•
IDE reset signal generation/PCIRST# buffers
•
Voltage translation for Audio MIDI signal
•
Audio-disable circuit
•
Voltage translation for DDC to monitor
•
Tri-state buffers for test
More information regarding this component is available from the following vendors:
Table 6-2. Glue Chip 3 Vendors
Vendor Intel Contact Contact Information
Fujitsu Microelectronics Customer Response Center
3545 North 1st Street, M/S 104
San Jose, CA 95134-1804
fax: [phone]
email: [e-mail]
Mitel Semiconductor Mitel Semiconductor http://www.mitelsemi.com