User's Manual

Intel
®
820 Chipset Design Guide 6-7
System Design Considerations
6.2 Power Plane Splits
Figure 6-4 shows an EXAMPLE of the power plane splits on an Intel
®
820 chipset platform.
6.3 Thermal Design Power
The thermal design power is the estimated maximum possible expected power generated in a
component by a realistic application. It is based on extrapolations in both hardware and software
technology over the life of the product. It does not represent the expected power generated by a
power virus. Refer to the Intel
®
820 Chipset Application Note: Thermal Design Considerations,
for the thermal measurement methodology.
The thermal design power numbers for the MCH, MTH, and the ICH are listed in Table 6-1.
Figure 6-4. Power Plane Split Example
Table 6-1. Intel
®
820 Chipset Component Thermal Design Power
Component Thermal Design Power (133/400 MHz)
MCH 3.5W ±15%
MTH 2.5W ±15%
ICH 1.3W ±15%