User's Manual

Intel
®
820 Chipset Design Guide 1-1
Introduction
Introduction
1
The Intel
®
820 Chipset Design Guide provides design recommendations for systems using the
Intel
®
820 chipset. This includes motherboard layout and routing guidelines, system design issues
and requirements, debug recommendations, and board schematics. The design recommendations
should be used during system design. The guidelines have been developed to ensure maximum
flexibility for board designers while reducing the risk of board-related issues.
The Intel board schematics in Appendix A (uni-processor) and Appendix B (dual-processor) can be
used as references for board designers. A feature list is provided at the beginning of each appendix.
Although these schematics cover specific designs, the core schematics for each chipset component
remains the same for most Intel
®
820 chipset platforms. The appendices provides a set of reference
schematics for each chipset component, in addition to common motherboard options. Additional
flexibility is possible through other permutations of these options and components.
1.1 About This Design Guide
This design guide is intended for hardware designers who are experienced with PC architectures
and board design. The design guide assumes that the designer has a working knowledge of the
vocabulary and practices of PC hardware design.
•
This chapter introduces the designer to the purpose and organization of this design guide, and
provides a list of references of related documents. This chapter also provides an overview of
the Intel
®
820 chipset.
•
Chapter 2, "Layout/Routing Guidelines"—This chapter provides a detailed set of motherboard
layout and routing guidelines for designing an Intel
®
820 chipset based platform. The
motherboard functional units are covered (e.g., chipset component placement, system bus
routing, system memory layout, display cache interface, hub interface, IDE, AC’97, USB,
interrupts, SMBUS, PCD, LPC/FWH Flash BIOS, and RTC).
•
Chapter 3, "Advanced System Bus Design"— AGTL+ guidelines and theory of operation are
discussed. This chapter also provides more detail about the methodologies used to develop the
guidelines.
•
Chapter 4, "Clocking"— This chapter provides motherboard clocking guidelines (e.g., clock
architecture, routing, capacitor sites, clock power decoupling, and clock skew).
•
Chapter 5, "System Manufacturing"— This chapter includes board stackup requirements.
•
Chapter 6, "System Design Considerations"— This chapter includes guidelines regarding
power delivery, decoupling, thermal, and power sequencing.
•
Appendix A, "Reference Board Schematics: Uni-Processor "— This appendix provides a set
of schematics for Uni-processor designs. A feature list for the board design is also provided.
•
Appendix B, "Reference Board Schematics: Dual-Processor "— This appendix provides a set
of schematics for dual-processor designs. A feature list for the board design is also provided.