User Manual

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Contents
Chapter 1 Product overview
1.1 Package contents ......................................................................... 1-1
1.2 Features ........................................................................................ 1-1
1.3 Specications ............................................................................... 1-2
Chapter 2 Motherboard information
2.1 Before you proceed ..................................................................... 2-1
2.2 Motherboard layout ...................................................................... 2-2
2.3 Central Processing Unit (CPU) ................................................... 2-4
2.3.1 Installing the CPU ........................................................... 2-5
2.3.2 CPU heatsink and fan assembly installation ................... 2-7
2.4 System memory ........................................................................... 2-9
2.5 Jumpers ...................................................................................... 2-10
2.6 Connectors ................................................................................. 2-12
2.6.1 Rear panel connectors .................................................. 2-12
2.6.2 Internal connectors ....................................................... 2-14
Chapter 3 BIOS setup
3.1 BIOS setup program .................................................................... 3-1
3.1.1 BIOS menu screen .......................................................... 3-2
3.2 Main menu .................................................................................... 3-2
3.2.1 System Date [Day MM/DD/YYYY] .................................. 3-2
3.2.2 System Time [HH:MM:SS] .............................................. 3-2
3.3 Advanced menu ........................................................................... 3-3
3.3.1 Platform Misc Conguration ............................................ 3-3
3.3.2 CPU Conguration .......................................................... 3-4
3.3.3 System Agent (SA) Conguration ................................... 3-6
3.3.4 PCH Conguration .......................................................... 3-7
3.3.5 PCH Storage Conguration ............................................ 3-7
3.3.6 PCH-FW Conguration ................................................... 3-8
3.3.7 LVDS Conguration ........................................................ 3-9
3.3.8 Onboard Devices Conguration .................................... 3-11
3.3.9 APM Conguration ........................................................ 3-13
3.3.10 Network Stack Conguration ........................................ 3-13
3.3.11 HDD/SSD SMART Information ..................................... 3-14
3.3.12 USB Conguration ........................................................ 3-14