User Manual
Table Of Contents
- Safety information
- Chapter 1: Product Introduction
- Chapter 2: Hardware Setup
- Chapter 3: Installation Options
- Chapter 4: Motherboard Information
- Chapter 5: BIOS Setup
- 5.1 Managing and updating your BIOS
- 5.2 BIOS setup program
- 5.3 Main menu
- 5.4 Ai Tweaker
- 5.5 Performance Tuning menu
- 5.6 Advanced menu
- 5.6.1 Trusted Computing
- 5.6.2 ACPI Settings
- 5.6.3 Smart Settings
- 5.6.4 Super IO Configuration
- 5.6.5 Serial Port Console Redirection
- 5.6.6 Onboard LAN Configuration
- 5.6.7 APM
- 5.6.8 PCI Subsystem Settings
- 5.6.9 USB Configuration
- 5.6.10 CSM Configuration
- 5.6.11 NVMe Configuration
- 5.6.12 Network Stack Configuration
- 5.6.13 iSCSI Configuration
- 5.7 Platform Configuration menu
- 5.8 Socket Configuration menu
- 5.9 Event Logs menu
- 5.10 Server Mgmt menu
- 5.11 Security menu
- 5.12 Boot menu
- 5.13 Tool menu
- 5.14 Save & Exit menu
- Chapter 6: RAID Configuration
- Chapter 7: Driver Installation
- Appendix
5-12
Chapter 5: BIOS Setup
CPU1-2 Power Phase Control [Auto]
This item allows you to set the power phase control of the CPU.
[Auto] Automaticallysetthephasecontrolmode.
[Extreme] Settothefullphasemode.
DO NOT remove the thermal module. The thermal conditions should be monitored.
CPU1-2 Thermal Control [120]
Thisitemallowsyoutocongure the thermal control value. A higher temperature
providesawiderCPUpowerthermalrangeandextendstheoverclockingtoleranceto
enlargetheoverclockingpotential.
DO NOT remove the thermal module. The thermal conditions should be monitored.
DRAM-ABC / DRAM-DEF / DRAM-GHJ / DRAM-KLM Current Capability[100%]
TheDRAMcurrentcapabilityadjuststhetotalpowerrangeforDRAMoverclocking.
Ahighervalueprovidesawidertotalpowerrangeandextendstheoverclocking
frequency range simultaneously.
Congurationoptions:[100%][110%][120%][130%][140%]
DRAM-ABC / DRAM-DEF / DRAM-GHJ / DRAM-KLM Phase Control [100%]
This item allows you to set the power phase control of the DRAM.
[Auto] Automaticallysetthephasecontrolmode.
[Extreme] Settothefullphasemode.
DO NOT remove the thermal module. The thermal conditions should be monitored.